| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-22 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Certificate: ISO9001, ISO14000, Ts16949.UL.RoHS;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Surface Finish: Lead Free HASL;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Layer: 1L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Certificate: UL,ISO 9001,ISO14001,IATF16949;
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
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Metal Coating: Gold;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Layer: 1L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Certificate: UL,ISO 9001,ISO14001,IATF16949;
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
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Metal Coating: Copper;
Mode of Production: SMT & DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Layer: 1 to 20;
Flame Retardant Properties: 94V0;
Insulation Material: Organic Resin;
PCB Type: Rigid PCB Circuit Board;
Certificate: ISO/CQC/IATF/UL/RoHS;
PCBA-Testing: X-ray, Aoi;
Surface Finishing: OSP, Immersion Gold, Gold Plating, Enig, Enepig;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Board Thickness: 0.2mm-8mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
PCBA Packaging: ESD Bag+Bubble Wrapped +Carton;
OEM/ODM: Support;
Warranty: 1 Year;
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Metal Coating: Copper;
Mode of Production: SMT & DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Layer: 1 to 20;
Flame Retardant Properties: 94V0;
Insulation Material: Organic Resin;
PCB Type: Rigid PCB Circuit Board;
Certificate: ISO/CQC/IATF/UL/RoHS;
PCBA-Testing: X-ray, Aoi;
Surface Finishing: OSP, Immersion Gold, Gold Plating, Enig, Enepig;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Board Thickness: 0.2mm-8mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
PCBA Packaging: ESD Bag+Bubble Wrapped +Carton;
OEM/ODM: Support;
Warranty: 1 Year;
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