Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-22 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Certificate: ISO9001, ISO14000, Ts16949.UL.RoHS;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Surface Finish: Lead Free HASL;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Other PCBA Service: Conformal Coating;
PCBA Min. Chip Placement: 0201;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Material Type: Fr-4/Htg150-180 Fr-4/Cem-1/Cem-3/Aluminum;
Board Thickness: 0.2mm--4.0mm;
Minimum Trace Width: 3mil;
Min Space Width: 4mil;
Min Drilling Dia: 0.2mm;
Pth Copper Thickness: 0.4-2mil(10-50um);
Tolerance of Eteching: ± 1mil(± 25um);
Surface Finish/Plating: HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gol;
Tg Value: 130, 135, 140, 150, 170, 180;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Material Type: Fr-4/Htg150-180 Fr-4/Cem-1/Cem-3/Aluminum;
Board Thickness: 0.2mm--4.0mm;
Minimum Trace Width: 3mil;
Min Space Width: 4mil;
Min Drilling Dia: 0.2mm;
Pth Copper Thickness: 0.4-2mil(10-50um);
Tolerance of Eteching: ± 1mil(± 25um);
Surface Finish/Plating: HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gol;
Tg Value: 130, 135, 140, 150, 170, 180;
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