Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Okey;
Service: Turnkey Assembly PCB Service;
Shape: Rectangular, Round, Slots, Cutouts, Complex, Irregula;
Board Thickness: 0.4-5.0mm;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil, Immersion Tin;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum, Copper Base;
Order Qty: Not Limited;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Customized: Customizable;
Min. SMD Size: 01005;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
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Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Ain;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aln, Al2O3;
Insulation Materials: Aln, Al2O3;
Model: PCB;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: Enig, Enepig, Immersion Silver;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Outline Tolerance(mm): 0.05mm;
Hole Tolerance: 0.05mm;
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Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Ain;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Ain, Al2O3;
Insulation Materials: Ain, Al2O3;
Model: PCB;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: Enig, Enepig, Immersion Silver;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Outline Tolerance(mm): 0.05mm;
Hole Tolerance: 0.05mm;
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Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Ain;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aln, Al2O3;
Insulation Materials: Aln, Al2O3;
Model: PCB;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: Enig, Enepig, Immersion Silver;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Outline Tolerance(mm): 0.05mm;
Hole Tolerance: 0.05mm;
Soldermask Color: White, Green, Black;
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Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Ain;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aln, Al2O3;
Insulation Materials: Aln, Al2O3;
Model: PCB;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: Enig, Enepig, Immersion Silver;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Outline Tolerance(mm): 0.05mm;
Hole Tolerance: 0.05mm;
Soldermask Color: White, Green, Black;
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