Specification |
Metal Coating: According to Customer Needs;
Mode of Production: SMT, DIP, Tht;
Layers: Single-Layer, Double-Layer, Multilayer;
Base Material: According to Customer Needs;
Customized: Customized;
Condition: New;
Layer Counts: 2-50 Layers;
Components Size: SMT 01005 to 100mmx80mm;
Minimum Width/Space of Qfp: 0.15mm/0.3mm;
Minimum Diameter /Space of BGA: 0.2mm/0.35mm;
Maximum Part's High: 18mm;
Maximum Part Weight: 30g;
PCB Size: 50mmx 50mm~450mmx 406mm;
PCB Thickness: 0.5mm~4. 5mm;
Placer Speed: 8,0000 Chips/Hour;
Feeders Number: 140 Piece of 8 mm Reel Feeders,28 of IC Tray Feede;
PCB Material: Fr4, High Tg Fr4,Halogen Free Material,Cem-3,etc;
Solder Mask Color: Green, Red, Black, Blue, White, Yellow, Matt, etc.;
Certificate: ISO13485, ISO9001, Ts , CQC, RoHS,CE;
Service: One-Stop Service;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: Fr4;
Customized: Customized;
Condition: New;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Fr4 Fr1 Cem1 Fr2;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: Fr4;
Customized: Customized;
Condition: New;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Fr4 Fr1 Cem1 Fr2;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: Fr4;
Customized: Customized;
Condition: New;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Fr4 Fr1 Cem1 Fr2;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: Fr4;
Customized: Customized;
Condition: New;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Fr4 Fr1 Cem1 Fr2;
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