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US$0.10-20.00 / Piece
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What is Quick Turn Prototype 5g Moudle Circuit Board PCB Half Hole of Gold Finger Printed Wiring Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-20.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Material Fr4
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Hl-PCB
  • Transport Package Vacuum Packing/Blister/Plastic /Carton
  • Trademark HonLynn Circuit
  • Origin Shenzhen, Guangdong
  • Surface Treatment Immersion Au
  • Mini Hole Diameter 0.25mm
  • Borad Thickness 1.6mm
  • Count Layer 4
  • Inner/Outer Copper Thickness 1oz/1oz
  • Min Trace Width/Spacing 4mil/4mil
  • Special 5g Communication PCB Board, Half Hole of Gold Fing
  • Certificated ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.

Product Description

Quick Turn Prototype 5G moudle circuit board PCB half hole of gold finger printed wiring board Shenzhen HonLynn circuit Co.,Ltd. is a High-level standard PCB customized manufacturing, a National High tech professional precise new enterprice. We certificated UL, ISO9001, ISO14001, ISO / ...

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PCB Comparison
Transaction Info
Price US $ 0.10-20.00/ Piece US $ 0.30-2.90/ pcs US $ 1.00-4.50/ pcs US $ 1.24-6.70/ pcs US $ 0.20-2.10/ pcs
Min Order 1 Pieces 1 pcs 1 pcs 1 pcs 1 pcs
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal, Money Gram L/C, T/T, Paypal L/C, T/T, Paypal L/C, T/T, Paypal L/C, T/T, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - OEM OEM OEM OEM
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Material: Fr4;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Au;
Mini Hole Diameter: 0.25mm;
Borad Thickness: 1.6mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 4mil/4mil;
Special: 5g Communication PCB Board, Half Hole of Gold Fing;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Hspcb;
Customized: Yes;
Type: Copper;
Dielectric: Copper;
Material: Copper;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Copper;
Brand: Hspcb;
Customized: Yes;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Hspcb;
Customized: Yes;
Type: Ceramics;
Dielectric: Ceramics;
Material: Ceramics;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Ceramics;
Insulation Materials: Ceramics;
Brand: Hspcb;
Customized: Yes;
Supplier Name

Shenzhen Honglian Circuit Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier