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US$0.10-20.00 / Piece
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What is Metal Base Cu Substrate Board Copper Circuit Board High Thermal Conductivity for Radiator

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-20.00 / Piece

Sepcifications

  • Type Combining Rigid Circuit Board
  • Material Cu Substrate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Hl-PCB
  • Transport Package Vacuum Packing/Blister/Plastic /Carton
  • Trademark HonLynn Circuit
  • Origin Shenzhen, Guangdong
  • Surface Treatment OSP
  • Mini Hole Diameter 0.5mm
  • Borad Thickness 1.6mm
  • Count Layer 2
  • Inner/Outer Copper Thickness 1oz/1oz
  • Min Trace Width/Spacing 10mil/10mil
  • Special Cu Substrate, Good Heat Dissipation for Power
  • Certificated ISO9001, ISO14001, IATF16949, UL, RoHS, CQC etc.

Product Description

Metal base Cu substrate board Copper circuit board high thermal conductivity for radiator Shenzhen Honglian circuit Co.,Ltd. is a High-level standard PCB customized manufacturing, a national High tech professional precise new enterprice. We certificated UL, ISO9001, ISO14001, ISO / TS16949, CQC ...

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PCB Comparison
Transaction Info
Price US $ 0.10-20.00/ Piece US $ 1.15/ Piece US $ 1.15/ Piece US $ 1.15/ Piece US $ 1.15/ Piece
Min Order 1 Pieces 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram
Quality Control
Management System Certification ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485 ISO 9001, IATF16949 ISO 9001, IATF16949 ISO 9001, IATF16949 ISO 9001, IATF16949
Trade Capacity
Export Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Material: Cu Substrate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: OSP;
Mini Hole Diameter: 0.5mm;
Borad Thickness: 1.6mm;
Count Layer: 2;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 10mil/10mil;
Special: Cu Substrate, Good Heat Dissipation for Power;
Certificated: ISO9001, ISO14001, IATF16949, UL, RoHS, CQC etc.;
Type: Rigid Circuit Board;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Type: Rigid Circuit Board;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Type: Rigid Circuit Board;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Type: Rigid Circuit Board;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Supplier Name

Shenzhen Honglian Circuit Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Jia Cheng Electric Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jia Cheng Electric Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jia Cheng Electric Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jia Cheng Electric Co., Ltd.

China Supplier - Diamond Member Audited Supplier