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US$0.10-20.00 / Piece
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94V0 Circuit Board 14L Multilayer Ultra Thick Copper PCB Board Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-20.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Material Fr4-S1141
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Hl-PCB
  • Transport Package Vacuum Packing/Blister/Plastic /Carton
  • Trademark HonLynn Circuit
  • Origin Shenzhen, Guangdong
  • Surface Treatment Immersion Au
  • Dielectric Constant 4.2
  • Mini Hole Diameter 0.5mm
  • Borad Thickness 5mm
  • Count Layer 14
  • Inner/Outer Copper Thickness 4oz/4oz
  • Certificated ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.

Product Description

94V0 circuit board 14L Multilayer Ultra Thick Cu pcb board Shenzhen HonLynn circuit Co.,Ltd. is a High-level standard PCB customized manufacturing, a National High tech professional precise new enterprice. We certificated UL, ISO9001, ISO14001, ISO / TS16949, CQC and a series of ...

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PCB Comparison
Transaction Info
Price US $ 0.10-20.00/ Piece US $ 0.75-1.26/ Piece US $ 0.03-0.46/ Piece US $ 0.50-1.20/ Piece US $ 15/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - FOB, CIF, DAT, FAS, DDP, DAP, CIP, FCA, EXW FOB, DDP, DAP, EXW FOB, DDP, DAP, EXW FOB, DDP, DAP, EXW
Payment Terms T/T, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal L/C, T/T L/C, T/T, Paypal L/C, T/T
Quality Control
Management System Certification ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model - OEM OEM OEM OEM
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Material: Fr4-S1141;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Au;
Dielectric Constant: 4.2;
Mini Hole Diameter: 0.5mm;
Borad Thickness: 5mm;
Count Layer: 14;
Inner/Outer Copper Thickness: 4oz/4oz;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customerised;
Surface Finish: Immersion/ Chemical Gold;
Overal Board Thickness: 1.57mm;
Inner Copper Thickness: 38um;
Outer Finished Copper Thickness: 45um;
Outline Size Tolerance: +/-6%;
Min Trade Width /Space: 4mil/4mil;
About Impedance: Unparelled Differential Impedance;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer: 24;
Thickness: 2.24;
Space: 0.127mm;
Surface: Enig;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer: 4;
Thickness: 2.0mm;
Min Hole: 0.3mm;
Surface: Enig;
Type: Rigid Circuit Board;
Dielectric: Ceramics;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Surface: Enig;
Thickness: 0.59mm;
Crafts: Ceramic Water;
Size: 200mm&300mm;
Supplier Name

Shenzhen Honglian Circuit Co., Ltd.

China Supplier - Gold Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier