Motherboards
US$77.00 / Piece
View
  • Recommend for you
  • What is Small Motherboard DDR3 Onboard 2USB SATA Msata Mainboard CF Card RAM VGA 4LAN RJ45 COM J1900 Motherboard
  • What is Brand New 24GB Memory Onboard 6th Generation CPU I3 I5 I7 Processor Computer Motherboard
  • What is AMD Ryzen 6000/7000 6600h/7535u/7735u 2*HDMI2.0 2*Type-C X86 Linux Nuc PC Motherboard for Desktop Computer

What is Gaming Motherboard J3455 RJ45 Msata SATA Mini PC Board VGA 2LAN Lvds HD Display Emmc Minipcie Gpio Motherboards

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10 Pieces US$77.00 / Piece

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 8G
  • Structure Nano
  • Memory DDR3
  • SATA Interface SATA3.0
  • CPU Socket BGA
  • Printed Circuit Board Six Layer
  • Main Board Structure Integrated
  • Transport Package Piesia Standard Package
  • Specification 120*120mm
  • Trademark piesia/oem
  • Origin Shenzhen, China

Product Description

Product Description Processor CPU Apollo lake series processor CPU Package BGA Chipset Apollo lake single chip BIOS EFI BIOS Memory Technology framework Single channel DDR3 1066/1333/1600/1866MHz RAM Socket DDR3 SODIMM 204 Socket Video Graphic controller Intel HD Graphics ...

Learn More

Motherboards Comparison
Transaction Info
Price US $ 77/ Piece US $ 3.6/ Piece US $ 3.6/ Piece Negotiable US $ 34.76-38.65/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 2 Pieces
Trade Terms - - - - FOB, EXW
Payment Terms T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal L/C, T/T, Western Union, Paypal, Cash
Quality Control
Management System Certification ISO 9001, HSE, QHSE, EICC ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe South America, Southeast Asia/ Mideast North America, South America, Southeast Asia, Africa, Mid East, Eastern Asia
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM OEM, ODM - OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: 1 Month(s)
Peak-season: 1 Month(s)
Off-season: 1 Month(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Nano;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Integrated Graphics: Integrated Graphics;
Main Chipset: nVidia;
Maximum Memory Capacity: 64G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: LGA 1156;
Printed Circuit Board: Four Layers;
Main Board Structure: CPU Based;
Audio Effects: HiFi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant: V0;
Solder Mask Colour: Black Green Red;
Surface Finishiing: HASL Lead Free;
Integrated Graphics: Integrated Graphics;
Main Chipset: nVidia;
Maximum Memory Capacity: 64G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: LGA 1156;
Printed Circuit Board: Four Layers;
Main Board Structure: CPU Based;
Audio Effects: HiFi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant: V0;
Solder Mask Colour: Black Green Red;
Surface Finishiing: HASL Lead Free;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Micro ATX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: LGA 1156;
Printed Circuit Board: Four Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
CPU: 1st Gen;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Structure: ATX;
Memory: DDR3;
CPU Socket: LGA 1155;
Chipset: Intel H61;
CPU: I3/I5/I7;
Size: 16.8cm*18.8cm;
Supplier Name

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen ITZR Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen DJS Co., Ltd.

China Supplier - Diamond Member Audited Supplier