Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Service: OEM/ODM, EMS;
PCB Material: Fr-4, Cem-1, Cem-3, Aluminum, Copper;
Copper Thickness: 18um-210um(6oz);
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finish/Treatment: HASL/RoHS, Immersion Silver/Gold, OSP, Gold Platin;
Solder Mask: Green/Black/White/Red/Blue/Yellow, etc;
Profiling Punching: Routing, V-Cut, Beveling;
Placement Precision: Qfp, Sop, Plcc, BGA;
Assembly Service: PCB Prototype, Components Sourcing and in-House;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
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