| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 20L;
Board Thickness: 2.56mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Matte Green;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Surface Finish: Immersion Silver;
X-Outs Allowed: Not Allowed;
Standard: Ipc Class 2;
Customized: Customized;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White.Black.Yellow.Green.Red.Blue;
PCB Silkscreen Color: Black.White.Yellow;
Number of Layers: 1-32;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
Service: One-Stop Turnkey;
Maximum Board Size: 640mm*1100mm;
Board Thickness: 0.2mm~6.0mm;
PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
Minimum Mechanical Drilling Aperture: 6mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Line Width/Spacing: 3.0mil;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 6L;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.15mm;
Surface Finish: Enig 2u";
X-Outs Allowed: Not Allowed;
Standard: Ipc Class 2;
Customized: Customized;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 6L;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Surface Finish: Enig 3u";
X-Outs Allowed: Not Allowed;
Standard: Ipc Class 3;
Customized: Customized;
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