Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: 2 Layer;
Copper Thickness: 1oz;
Condition: Original Made;
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Type: Rigid Circuit Board;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Gold;
Mini Hole Diameter: 0.4mm;
Borad Thickness: 0.1mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 4mil/4mil;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
Special: BGA Resin Plug Vias, The Min Hole 0.1mm;
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Type: Rigid Circuit Board;
Material: Fr4-S1000-2m;
Application: Automatives;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Lead HASL;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.6mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 2oz/2oz;
Min Trace Width/Spacing: 12mil/12mil;
Special: Automative Power Supply, High Reliability;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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Type: Rigid Circuit Board;
Material: Fr4;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Gold;
Mini Hole Diameter: 0.2mm;
Borad Thickness: 1.6mm;
Count Layer: 8;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 3mil/3mil;
Special: Impedance Control, Blue Solder Mask;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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