Flexible PCB
US$0.10-5.00 / Piece
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What is PS Professional Flexible Printed Circuit Board OEM Customized FPC Flex PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$5.00

100-999 Pieces US$1.00

1,000+ Pieces US$0.10

Sepcifications

  • Structure Single-Sided, Double-Sided, Multilayer
  • Material Polyimide
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand PS
  • Transport Package Box
  • Specification <1500mm
  • Trademark PS Electronics
  • Origin China
  • Quality Test Aoi, 100% E-Test
  • V- Cut Tolerance +-10mi
  • Bevel Edge +-5mil
  • Hole Location Tolerance +-2mil
  • Hole Diameter Tolerance +-0.05mm
  • Board Thickness Tolerance +-5%
  • Line Width/Space Tolerance +-10%

Product Description

PCB Parameters Item PCB Parameters Material FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Metal Core, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic, Teflon, etc Material Brands KB, ITEQ, SY, ISOLA, Rogers (Arlon), Ventec, Laird, Nelco, Bergquist, DENKA, Panasonic, Taconic, or ...

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Flexible PCB Comparison
Transaction Info
Price US $ 0.10-5.00/ Piece US $ 0.50-5.00/ pieces US $ 0.20-1.20/ pieces US $ 1.00-5.00/ pieces US $ 0.68-2.27/ Piece
Min Order 1 Pieces 5 pieces 5 pieces 5 pieces 5 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Wechat/Alipay T/T, Western Union, Paypal, Wechat/Alipay T/T, Western Union, Paypal, Wechat/Alipay T/T, Western Union, Paypal, Wechat/Alipay
Quality Control
Management System Certification ISO 9001, ISO 14001 ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Western Europe - - - -
Annual Export Revenue US$50 Million - US$100 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million
Business Model OEM, ODM - - - -
Average Lead Time Off Season Lead Time: 3-6 months
Peak Season Lead Time: 3-6 months
- - - -
Product Attributes
Specification
Structure: Single-Sided, Double-Sided, Multilayer;
Material: Polyimide;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pl, Copper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Board Thickness: 0.057 to 0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz-3oz;
Min. Hole Size: 0.15mm;
Board Thickness: 0.057-0.6mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Surface Finishing: Enig, Immersion Silver, OSP;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5-3oz;
Inner Layer Dielectric Thickness: 0.0275 To0.1mm;
Min. Line Width: 0.075mm;
Surface Finishing: Enig, Immersion Silver, OSP;
Min. Hole Size: 0.15mm;
Hole Diameter Tolerance of Npth: 1 Mil;
Board Thickness: 0.057-0.6mm;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Picopper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.15mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Surface Finishing: Enig, Immersion Silver, OSP;
Supplier Name

Ps Electronics Co., Ltd

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier