Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
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Structure: Single-Sided Rigid PCB;
Dielectric: Refer to The Official Documents;
Material: Refer to The Official Documents;
Application: Communication;
Flame Retardant Properties: Refer to The Official Documents;
Processing Technology: Refer to The Official Documents;
Production Process: Refer to The Official Documents;
Base Material: Refer to The Official Documents;
Insulation Materials: Refer to The Official Documents;
Brand: Murata;
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Structure: Refer to The Official Documents;
Dielectric: Refer to The Official Documents;
Material: Refer to The Official Documents;
Application: Communication;
Flame Retardant Properties: Refer to The Official Documents;
Processing Technology: Refer to The Official Documents;
Production Process: Refer to The Official Documents;
Base Material: Refer to The Official Documents;
Insulation Materials: Refer to The Official Documents;
Brand: Murata;
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Structure: Double-Sided Rigid PCB;
Dielectric: RO4533;
Material: Ceramic-Filled, Glass-Reinforced Hydrocarbon;
Application: Antenna;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Immersion Gold;
Laminate Thickness: 60mil;
Layer Count: Double Sided PCB;
Dielectric Constant: 3.3;
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Structure: Multilayer Rigid PCB;
Dielectric: Rt Duroid 5880lz;
Material: Unique Filled PTFE Composites;
Application: Stripline and Microstrip;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Laminate Thickness: 10mil 20mil 50mil and 100mil;
Layer Count: Single Sided, Double Sided, Multilayer PCB, Hybrid;
Dielectric Constant: 2;
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