PS Blind Bombing Equipment PCBA with Good Quality Video

Name: PS Blind Bombing Equipment PCBA with Good Quality
Uploaded: 2024-01-31T18:02:38+08:00
Description: PCB Parameters Item PCB Parameters Material FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Metal Core, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic, etc Material Brands KB, ITEQ, SY, IS

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Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$5.00

100-999 Pieces US$1.00

1,000+ Pieces US$0.10

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Aluminum
Brand PS
Transport Package Box
Specification <1500mm
Trademark PS Electronics
Origin China
Quality Test Aoi, 100% E-Test
V- Cut Tolerance +-10mi
Bevel Edge +-5mil
Hole Location Tolerance +-2mil
Hole Diameter Tolerance +-0.05mm
Board Thickness Tolerance +-5%
Line Width/Space Tolerance +-10%

Product Description

PCB Parameters Item PCB Parameters Material FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Metal Core, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic, etc Material Brands KB, ITEQ, SY, ISOLA, Rogers (Arlon), Ventec, Laird, Nelco, Bergquist, DENKA, Panasonic, Taconic, or other ...

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Ps Electronics Co., Ltd

Diamond Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products PCB Design, PCB, PCB Assembly
Number of Employees 58
Year of Establishment 2018-05-10
Management System Certification ISO9001:2015, ISO14001:2015
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCBA Comparison

	PS Blind Bombing Equipment PCBA with Good Quality Contact Now	Quick View Automobile Sensors High Density Interconnect HDI PCB 4layer It158 Enig Contact Now	Quick View 6L/8layer High Density Interconnect HDI PCB for Automobile Data Recorder Contact Now	Quick View Multilayer 8layer HDI PCB Shengyi S1000h Enig for Automobile GPS Contact Now	Quick View Shengyi Material S1000h 2.0mm HDI PCB Enig for Telecom Servers Contact Now

Transaction Info
	PS Blind Bombing Equipment PCBA with Good Quality Contact Now	Quick View Automobile Sensors High Density Interconnect HDI PCB 4layer It158 Enig Contact Now	Quick View 6L/8layer High Density Interconnect HDI PCB for Automobile Data Recorder Contact Now	Quick View Multilayer 8layer HDI PCB Shengyi S1000h Enig for Automobile GPS Contact Now	Quick View Shengyi Material S1000h 2.0mm HDI PCB Enig for Telecom Servers Contact Now
Price	US $ 0.10-5.00/ Piece	US $ 0.55-3.69/ Piece	US $ 2.12-9.37/ Piece	US $ 1.95-8.83/ Piece	US $ 1.05-7.63/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: 3-6 months Peak Season Lead Time: 3-6 months	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Aluminum; Brand: PS; Quality Test: Aoi, 100% E-Test; V- Cut Tolerance: +-10mi; Bevel Edge: +-5mil; Hole Location Tolerance: +-2mil; Hole Diameter Tolerance: +-0.05mm; Board Thickness Tolerance: +-5%; Line Width/Space Tolerance: +-10%;	Structure: HDI PCB; Dielectric: Fr4 It158 0.8mm; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 4layer - 18layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling;	Structure: HDI PCB; Dielectric: Fr4 Em825 1.2mm; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6layer - 8layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Unit Size: 242mm X 165mm;	Structure: HDI PCB; Dielectric: Fr4 Em825 1.2mm; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 8layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Other: Resin Plugged;	Structure: Fr4 Shengyi Material; Dielectric: Fr4 S1000h 2.0mm; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Min. Hole Wall Cu: 25um;
Supplier Name	Ps Electronics Co., Ltd	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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