PCBA
US$0.10-5.00 / Piece
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PS Access Control Terminals From Medical Industry PCBA Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$5.00

100-999 Pieces US$1.00

1,000+ Pieces US$0.10

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Aluminum
  • Brand PS
  • Transport Package Box
  • Specification <1500mm
  • Trademark PS Electronics
  • Origin China
  • Quality Test Aoi, 100% E-Test
  • V- Cut Tolerance +-10mi
  • Bevel Edge +-5mil
  • Hole Location Tolerance +-2mil
  • Hole Diameter Tolerance +-0.05mm
  • Board Thickness Tolerance +-5%
  • Line Width/Space Tolerance +-10%

Product Description

PCB Parameters Item PCB Parameters Material FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Metal Core, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic, Teflon, etc Material Brands KB, ITEQ, SY, ISOLA, Rogers (Arlon), Ventec, Laird, Nelco, Bergquist, DENKA, Panasonic, Taconic, or ...

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PCBA Comparison
Transaction Info
Price US $ 0.10-5.00/ Piece US $ 1.62-18.50/ Piece US $ 1.30-16.00/ Piece US $ 1.62-18.60/ Piece US $ 1.74-19.30/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification - ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue - - - - -
Business Model - OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
Structure: HDI PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Blind&Buried Vias;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 4layer - 8layer;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Special Material: Em825;
Blind/Buried Vias: 0.1mm Laser Drilling;
Structure: HDI PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Blind&Buried Vias;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 4layer - 8layer;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Special Material: Em825;
Blind/Buried Vias: 0.1mm Laser Drilling;
Other: Half-Hole;
Structure: HDI PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Blind&Buried Vias;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 4layer - 10layer;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Special Material: Em825;
Blind/Buried Vias: 0.1mm Laser Drilling;
Other: Plugging Hole with Resin;
Structure: HDI PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Blind&Buried Vias;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 6layer - 12layer;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Special Material: Em825, S1000h;
Blind/Buried Vias: 0.1mm Laser Drilling;
Supplier Name

Ps Electronics Co., Ltd

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier