Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Aerospace;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Layer Counts: 1-30 Layers;
Board Thickness: 0.20mm-8.00mm;
Maximum Size: 600mmx1200mm;
Insulation Layer Thickness: 0.075mm--5.00mm;
Minimum Line: 0.075mm;
Minimum Space: 0.075mm;
out Layer Copper Thickness: 18um--350um;
Inner Layer Copper Thickness: 17um--175um;
Diameter Tolerance(Mechanical): 0.05mm;
|
Structure: Single-Sided Rigid PCB;
Dielectric: Xpc;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Phenolic Paper;
Insulation Materials: Phenolic Resin;
Brand: Hjh;
Sheet Thckness: 0.8-1.6mm;
Copper Thickness: 18um, 25um, 35um, Others;
Color: Brown;
Market: Euro, Asia, Central and South America;
|
Structure: Single-Sided Rigid PCB;
Dielectric: FR-2;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Phenolic Paper;
Insulation Materials: Phenolic Resin;
Brand: Hjh;
Sheet Thickness: 0.8~1.6mm;
Copper Thickness: 18um, 35um, Others;
Color: Brown;
Market: Euro, Asia, Central and South America;
|
Structure: Single-Sided Rigid PCB;
Dielectric: FR-1;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Phenolic Paper;
Insulation Materials: Phenolic Resin;
Brand: Hjh;
Sheet Thickness: 0.8-1.6mm;
Copper Thickness: 18um, 25um, 35um, Others;
Color: Brown;
Market: Euro, Asia, Central and South America;
|