Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Specified Types: 8-16s Li-ion/Li-Polymer/LiFePO4 Battery;
L-Ion/Li-Polymer Charging Voltage: 33.6V-67.2V;
LiFePO4 Charging Voltage: 28.8V-57.6V;
Max. Continuous Charging Current: 20A(Max);
Maximal Continuous Discharging Current: 20A(Max);
Discharge Overcurrent Protection: 50±10A(Adjustable);
Colour of PCM: Green and Yellow;
Balance: No;
Warranty: 12 Months;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Unos R3 Development Board: Mega 2560 R3;
PRO Mini Atmega328p: 1;
Package: SMD;
Quality: 100% Test Past;
Service: One Stop Bom Service;
IC: Integrated Circuit;
Trade Item: EXW;
Shipping: Customers Requirement;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Composition 1: Sn63pb37;
Composition 2: Sn60pb40;
Composition 3: Sn50pb50;
Wire Diameter: 0.2mm to 3.2mm;
Core: Rosin Core or Solid Wire;
Application 1: Electronics Soldering;
Application 2: Plumbing Soldering;
Application 3: Stained Glass Soldering;
Flux Type: No Clean;
Weight Per Roll: 50g to 1000g;
OEM Service: Yes;
MOQ: 100kgs;
Types of Solder: Tin Lead;
Weight Per Jar: 1lb;
Alloy Composition: 63% Tin and 37% Lead;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: Alu;
Customized: Customized;
Condition: New;
Certificate: ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Board Thickness: 0.2mm-8mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
Service: PCB/Componentssourcing/Assembly/Test/Package;
PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict);
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Profiling Punching: Routing, V-Cut, Beveling;
Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
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