Specification |
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 3 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Lead Time: 1--3 Days;
Quality: 100% Tested;
Shipping Ways: DHL, FedEx, TNT, UPS, EMS, by Sea;
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After-sales Service: 7*24 Hour After-Sales Service;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Binding Force: 500 N (Max);
Wafer Size: Wafer Size: 8" - 12" (4", 6" Customizable);
Substrate Type: Fr4, Ceramic, Flex, Boat, 8"/12" Wafers, Othe;
Uph: up to 10,000 Pieces Per Hour (Max);
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After-sales Service: 7*24 Hour After-Sales Service;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Equipment Applications: Coc, COB, Gold Box, Cow, Cos;
Weights: 2200kg;
Nozzle: 12 Nozzles Per Head, with Dynamic Tool Change;
Working Table: 2;
Transfer Table: up to 8 Working Tables (Per Machine);
Temperature Range: up to 500°c (Maximum);
Temperature Rising Rate: 50°c/S (Maximum);
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After-sales Service: After Sales Service;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Stability: Very Stable;
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After-sales Service: 7*24 Hour After-Sales Service;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Binding Force: 10~7,500 G (Programmable);
Uph: 7000(Max);
X/Y Placement Accuracy: ± 7µm @ 3σ;
Theta Placement Accuracy: ±0.15°@ 3σ;
Bonding Head Heatingtemperatur: up to 350 °c (Optional);
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