| Specification |
Conductive Type: Unipolar Integrated Circuit;
Integration: MSI;
Mounting Type: SMT;
Operating Temperature: -20℃~40℃;
Shape: Board;
Technics: Application-Specific Integrated Circuit;
Radio Frequency: DC-6GHz;
Board Channel Count: 6t16r;
ADC: 14bit;
Dac: 14bit;
Sfdr: 70dbc@Typ;
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Conductive Type: Bipolar Integrated Circuit;
Integration: MSI;
Mounting Type: SMT;
Operating Temperature: -40℃ - 85℃;
Shape: Flat;
Technics: Thick Film IC;
Data Converters: a/D 8X10b;
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V;
Eeprom Size: 256 X 8;
Speed: 32MHz;
Connectivity: I2c, Spi, Uart/Usart;
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Conductive Type: Unipolar Integrated Circuit;
Integration: MSI;
Mounting Type: SMT;
Operating Temperature: -40℃ - 85℃;
Shape: Flat;
Technics: Thick Film IC;
Program Memory Size: 3.5kb (2K X 14);
Eeprom Size: 256 X 8;
RAM Size: 256 X 8;
Program Memory Type: Flash;
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V;
Data Converters: a/D 12X10b;
Speed: 32MHz;
Connectivity: I2c, Spi, Uart/Usart;
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Conductive Type: Bipolar Integrated Circuit;
Integration: MSI;
Mounting Type: SMT;
Operating Temperature: -40℃ - 85℃;
Shape: Round;
Technics: Thick Film IC;
Core Size: 16-Bit;
Speed: 40 Mips;
Connectivity: I2c, IrDA, Linbus, Spi, Uart/Usart;
RAM Size: 2K X 8;
Data Converters: a/D 16X10b; D/a 4X10b;
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Conductive Type: Bipolar Integrated Circuit;
Integration: MSI;
Mounting Type: SMT;
Operating Temperature: -40℃ - 85℃;
Shape: Flat;
Technics: Thick Film IC;
Core Size: 32-Bit;
Speed: 40MHz;
Connectivity: I2c, IrDA, Linbus, PMP, Spi, Uart/Usart, USB OTG;
RAM Size: 32K X 8;
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V;
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