Specification |
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-6;
Customized: Customized;
Condition: New;
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Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
Mode of Production: SMT and DIP;
Layers: Multilayer;
Base Material: Fr-4/ High Tg Fr-4/ Aluminum/ Ceramic/ Copper/ Hal;
Customized: Customized;
Condition: New;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing,Flying Probe Tester,Functional;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2837;
RAM: 1GB;
USB: 4 USB 2 Ports;
Other: 40-Pin Extended Gpio;
Wireless/Bluetooth: Yes;
Application: IoT/Ai;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA: Assembly;
PCB: Fr4;
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Metal Coating: Tin;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: Spi,Aoi,Ict,Fct,X-ray,RoHS and Aging.;
Min. Component: 01005;
Max. PCB Mulitylayer: up to 64 Layers;
Max PCB Dimension: 740*400mm;
MOQ: Custom;
Production Line: 5 SMT;
Employees: 200+;
Application Scenario: Medical, Industrial, Automotive, POS Terminal;
Production Equipments: Printing, SMT, Board Dividing, Spi, X-ray Machine;
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