Intel X86 DDR4 H110 LGA1151 6 7 8 9th I3 I5 I7 Mini Itx Motherboard 2 COM

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$81.00 / Piece

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 16G
  • Structure Mini-ITX
  • Memory DDR4
  • CPU Socket LGA1151
  • Printed Circuit Board Six Layer
  • Main Board Structure Socket for Intel 6th I3/I5/I7 Processor
  • Audio Effects HiFi
  • Transport Package Netrual Carton Box
  • Specification 170mm x 170mm
  • Origin China
  • Processor Supported Support LGA1151 Intelcore I3/I5/I7/Celeron CPU
  • RAM 2* DDR4 SODIMM Memory Slot
  • Power DC 12V 19V Power Supply
  • OS Supported Windows 7/ 8.1/ 10
  • BIOS 64MB Flash ROM
  • Ethernet Ports 1* RJ45 Gigabit LAN Port
  • Display 1 X VGA ,1 X HDMI,1X Dp or Lvds
  • Storage 2* SATA,1* Msata
  • Chipset Intel H110 Express Chipset

Product Description

Support LGA1151 Intel® Core™ i3/i5/i7/Celeron/Pentium SkyLake/KabyLake-S Processor Intel® H110 Express chipset, compatible with Intel®Q170/ Q150/H170/Z170 chipset 2* DDR4 SODIMM memory slot, up to 32Gb 1* VGA (DP Optional),1* HDMI,1* LVDS 1* RTL8111 Gigabit Ethernet 2* COM port , ...

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Motherboard Comparison
Transaction Info
Price US $ 81/ Piece US $ 145/ Piece US $ 277.00-285.00/ Piece US $ 60.00-90.00/ Piece US $ 58.00-65.00/ Piece
Min Order 1 Pieces 100 Pieces 10 Pieces 100 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Paypal T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram
Quality Control
Management System Certification ISO 9001 ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: Mini-ITX;
Memory: DDR4;
CPU Socket: LGA1151;
Printed Circuit Board: Six Layer;
Main Board Structure: Socket for Intel 6th I3/I5/I7 Processor;
Audio Effects: HiFi;
Processor Supported: Support LGA1151 Intelcore I3/I5/I7/Celeron CPU;
RAM: 2* DDR4 SODIMM Memory Slot;
Power: DC 12V 19V Power Supply;
OS Supported: Windows 7/ 8.1/ 10;
BIOS: 64MB Flash ROM;
Ethernet Ports: 1* RJ45 Gigabit LAN Port;
Display: 1 X VGA ,1 X HDMI,1X Dp or Lvds;
Storage: 2* SATA,1* Msata;
Chipset: Intel H110 Express Chipset;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: Intel;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Mini-ITX;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: Slot2;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: Intel;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA2.0;
CPU Socket: Intel;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
Supplier Name

R&O Industrial Technology Co., Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier