High-Temperature Boron Nitride Ceramic Insulator Plate pictures & photos

High-Temperature Boron Nitride Ceramic Insulator Plate

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Price

Purchase Qty. Reference FOB Price

100-999 kg US$160.00

1,000+ kg US$150.00

Sepcifications

Application Refractory, Structure Ceramic, Industrial Ceramic, Dielectric Ceramic
Material Boron Nitride
Type Ceramic Parts
Transport Package Vacuum Bag, Carton
Specification ceramic parts
Trademark PENSC
Origin China
Shape Customize

Product Description

Product Description PENSC Boron Nitride Powder Solutions merge the key properties of hexagonal boron nitride (hBN) and over 20 years of manufacturing expertise to offer a complete portfolio of hBN powders. With a variety of particle shapes and sizes available, PENSC Boron Nitride Powder Solutions ...

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Shandong Pengcheng Advanced Ceramics Co., Ltd.

Gold Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Evaporation Boats, Boron Nitride Ceramics, Aluminum Nitride Ceramics, Boron Nitride Powder, Titanium Diboride Ceramics, Titanium Diboride Powder
Number of Employees 89
Year of Establishment 2014-08-13
Management System Certification ISO9001:2015
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

High-Temperature Resistance Comparison

	High-Temperature Boron Nitride Ceramic Insulator Plate Contact Now	Quick View 120*120 mm Thickness 0.2-2mm Square Round or Rectangular Insulation Property Alumina Ceramic Substrate Contact Now	Quick View 138*190mm Thickness 0.2-2mm Square Round or Rectangular Heat Dissipation Ceramic Substrate Contact Now	Quick View Unfired Ceramic Substrate for Power Electronics Contact Now	Quick View Blank Ceramic Substrate for Power Electronics Contact Now

Transaction Info
	High-Temperature Boron Nitride Ceramic Insulator Plate Contact Now	Quick View 120*120 mm Thickness 0.2-2mm Square Round or Rectangular Insulation Property Alumina Ceramic Substrate Contact Now	Quick View 138*190mm Thickness 0.2-2mm Square Round or Rectangular Heat Dissipation Ceramic Substrate Contact Now	Quick View Unfired Ceramic Substrate for Power Electronics Contact Now	Quick View Blank Ceramic Substrate for Power Electronics Contact Now
Price	US $ 150.00-160.00/ kg	US $ 0.04-0.57/ Piece	US $ 0.04-0.57/ Piece	US $ 0.04-0.57/ Piece	US $ 0.04-0.57/ Piece
Min Order	100 kg	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union	L/C, T/T, D/P, Paypal	L/C, T/T, D/P, Paypal	L/C, T/T, D/P, Paypal	L/C, T/T, D/P, Paypal
Quality Control
Management System Certification	ISO 9001	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	South America, Europe, Southeast Asia/ Mideast	Southeast Asia, Eastern Asia	Southeast Asia, Eastern Asia	Southeast Asia, Eastern Asia	Southeast Asia, Eastern Asia
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)
Product Attributes
Specification	Application: Refractory, Structure Ceramic, Industrial Ceramic, Dielectric Ceramic; Material: Boron Nitride; Type: Ceramic Parts; Shape: Customize;	Application: Industrial Ceramic, Electronic Ceramic; Grain Size: 1-10um; Purity: 96%, 99.6%; Type: Ceramic Plates; Delivery: 30 Days; Thermal Conductivity: Min 24 W/Mk; Young's Modulus: 340 Gpa; Thickness: 0.2-2mm; Forming Method: Tape Casting; Material: Alumina Ceramic;	Application: Industrial Ceramic, Electronic Ceramic; Material: Alumina Ceramic; Type: Ceramic Plates; Delivery: 30 Days; Thermal Conductivity: Min 24 W/Mk; Young's Modulus: 340 Gpa; Thickness: 0.2-2mm; Forming Method: Tape Casting;	Application: Industrial Ceramic, Electronic Ceramic; Material: Alumina Ceramic; Type: Ceramic Plates; Delivery: 30 Days; Thermal Conductivity: Min 24 W/Mk; Young's Modulus: 340 Gpa; Thickness: 0.2-2mm; Forming Method: Tape Casting;	Application: Industrial Ceramic, Electronic Ceramic; Material: Alumina Ceramic; Type: Ceramic Plates; Delivery: 30 Days; Thermal Conductivity: Min 24 W/Mk; Young's Modulus: 340 Gpa; Thickness: 0.2-2mm; Forming Method: Tape Casting;
Supplier Name	Shandong Pengcheng Advanced Ceramics Co., Ltd.	Binzhou Aonuo New Material Technology Co., Ltd.	Binzhou Aonuo New Material Technology Co., Ltd.	Binzhou Aonuo New Material Technology Co., Ltd.	Binzhou Aonuo New Material Technology Co., Ltd.
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