Good Price Fr4 Ccl Epoxy Resin Board for Printed Circuit Board pictures & photos

Good Price Fr4 Ccl Epoxy Resin Board for Printed Circuit Board

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About this Item

Price

Min. Order Reference FOB Price

50 Square Meters Negotiable

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material PTFE
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Delay Pressure Foil
Production Process Additive Process
Base Material Copper
Insulation Materials Metal Composite Materials
Transport Package Cardboard Box
Trademark SENRONG
Origin Zibo City
Size Customization
Tensile Strength Excellent

Product Description

Copper Clad Laminate, abbreviated to CCL, is a type of base material of PCBs. With glass fiber or wood pulp paper as reinforcing material, a CCL is a type of product through lamination with copper clad on either one side or both sides of reinforcing material after being soaked in resin. According ...

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Shandong Senrong New Materials Co., Ltd.

Diamond Member Since 2012

Audited Supplier

Business Type Manufacturer/Factory
Main Products PTFE Fiber, PTFE Rod, PTFE Tube, PTFE Plate, PTFE Membrane
Number of Employees 168
Year of Establishment 2006-06-22
Management System Certification ISO9001:2015, ISO14001:2015, ISO45001:2016
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Circuit Board Comparison

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Transaction Info
	Good Price Fr4 Ccl Epoxy Resin Board for Printed Circuit Board Contact Now	Quick View Fr4 Custom Design PCB Supports ANSI DIY Mechanical Keyboard Contact Now	Quick View 8L Buried & Blind Vias PCB, Impedance Control HDI PCB Assembly Contact Now	Quick View PCB Layout Design Prototype Services OEM PCB Board Circuit Custom Circuit Contact Now	Quick View High Quality Fr4 94V0 PCB Plate Factory in Shenzhen with OEM Service Contact Now
Price	Negotiable	US $ 0.50-10.00/ Piece	US $ 0.50-10.00/ Piece	US $ 0.50-10.00/ Piece	US $ 0.375-0.40/ Piece
Min Order	50 Square Meters	1 Pieces	1 Pieces	1 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T
Quality Control
Product Certification	-	RoHS, CCC, ISO, EPA	RoHS, CCC, ISO, EPA	RoHS, CCC, ISO, EPA	-
Management System Certification	-	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Europe	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	-
Annual Export Revenue	> US $100 Million	-	-	-	-
Business Model	Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Resin; Application: Communication; Processing Technology: Electrolytic Foil; Production Process: Immersion Gold; Base Material: It180A; Board Thickness: 1.6mm; Copper Thickness: 2oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 0.1mm; Min. Hole Size: 0.2mm; Customized: Customized;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Resin; Application: Communication; Processing Technology: Electrolytic Foil; Production Process: Immersion Gold; Base Material: It180A; Board Thickness: 1.6mm; Copper Thickness: 2oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 0.1mm; Min. Hole Size: 0.2mm; Customized: Customized;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Resin; Application: Communication; Processing Technology: Electrolytic Foil; Production Process: Immersion Gold; Base Material: It180A; Board Thickness: 1.6mm; Copper Thickness: 2oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 0.1mm; Min. Hole Size: 0.2mm; Customized: Customized;	Structure: Single-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: HASL;
Supplier Name	Shandong Senrong New Materials Co., Ltd.	Usun Electronics Limited.,	Usun Electronics Limited.,	Usun Electronics Limited.,	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.
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