Phenolic Resin Base Paper Panel Fr1/Xpc Ccl Insulation Paper Sheet/Board for PCB Custom Size

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

50 Square Meters Negotiable

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material PTFE
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Delay Pressure Foil
  • Production Process Additive Process
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Transport Package Cardboard Box
  • Trademark SENRONG
  • Origin Zibo City
  • Size Customization
  • Tensile Strength Excellent

Product Description

Copper Clad Laminate, abbreviated to CCL, is a type of base material of PCBs. With glass fiber or wood pulp paper as reinforcing material, a CCL is a type of product through lamination with copper clad on either one side or both sides of reinforcing material after being soaked in resin. According ...

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Circuit Board Comparison
Transaction Info
Price Negotiable US $ 2.00-4.50/ Piece US $ 1.50-4.50/ Piece US $ 2.00-4.50/ Piece US $ 2.00-4.50/ Piece
Min Order 50 Square Meters 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T T/T, Western Union, Paypal, Money Gram, Alipay, Alibaba Trade Assurance Order T/T, Western Union, Paypal, Money Gram, Alipay, Alibaba Trade Assurance Order T/T, Western Union, Paypal, Money Gram, Alipay, Alibaba Trade Assurance Order T/T, Western Union, Paypal, Money Gram, Alipay, Alibaba Trade Assurance Order
Quality Control
Management System Certification - ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14000, IATF16949, GMP
Trade Capacity
Export Markets North America, South America, Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe
Annual Export Revenue > US $100 Million - - - -
Business Model Own Brand OEM, ODM, Others OEM, ODM, Others OEM, ODM, Others OEM, ODM, Others
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: PTFE;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Size: Customization;
Tensile Strength: Excellent;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
Supplier Name

Shandong Senrong New Materials Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier