PCB Laminated Board Copper Clad Laminate Ccl Sheets Fr4 Fr2 Fr1

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

50 Square Meters Negotiable

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material PTFE
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Delay Pressure Foil
  • Production Process Additive Process
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Transport Package Cardboard Box
  • Trademark SENRONG
  • Origin Zibo City
  • Size Customization
  • Tensile Strength Excellent

Product Description

Product Description Copper Clad Laminate, abbreviated to CCL, is a type of base material of PCBs. With glass fiber or wood pulp paper as reinforcing material, a CCL is a type of product through lamination with copper clad on either one side or both sides of reinforcing material after being ...

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Transaction Info
Price Negotiable US $ 0.50-10.00/ Piece US $ 0.50-6.00/ Piece US $ 0.50-10.00/ Piece US $ 0.50-10.00/ Piece
Min Order 50 Square Meters 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - RoHS, CCC, ISO, EPA - RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA
Management System Certification - ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485
Trade Capacity
Export Markets North America, South America, Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe
Annual Export Revenue > US $100 Million - - - -
Business Model Own Brand OEM, ODM, Own Brand OEM, ODM, Others OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: PTFE;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Size: Customization;
Tensile Strength: Excellent;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: It180A;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 6L;
Board Thickness: 1.57mm;
Copper Thickness: 1.5oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.25mm;
Surface Finish: Enig 2u";
X-Outs Allowed: Not Allowed;
Standard: Ipc Class 3;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 14L;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Red;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Surface Finish: Enig 2u";
X-Outs Allowed: Not Allowed;
Standard: Ipc Class 2;
Customized: Customized;
Supplier Name

Shandong Senrong New Materials Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier