New Products High Frequency Ccl Material Printed Circuit Board Rigid PCB

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

50 Square Meters Negotiable

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material PTFE
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Delay Pressure Foil
  • Production Process Additive Process
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Transport Package Cardboard Box
  • Trademark SENRONG
  • Origin Zibo City
  • Size Customization
  • Tensile Strength Excellent

Product Description

Copper Clad Laminate, abbreviated to CCL, is a type of base material of PCBs. With glass fiber or wood pulp paper as reinforcing material, a CCL is a type of product through lamination with copper clad on either one side or both sides of reinforcing material after being soaked in resin. According ...

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Circuit Board Comparison
Transaction Info
Price Negotiable US $ 0.099-1.20/ Piece US $ 0.80-6.80/ Piece US $ 0.156-0.80/ Piece US $ 2.25-8.80/ Piece
Min Order 50 Square Meters 100 Pieces 1 Pieces 100 Pieces 100 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification - ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets North America, South America, Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue > US $100 Million - - - -
Business Model Own Brand OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: 1 Month(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: PTFE;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Size: Customization;
Tensile Strength: Excellent;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Industrial Control;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 4L up to 60L;
Board Thickness: 2.0mm up to 8mm;
Min Hole Size: 0.4mm;
Min. Hole Wall Cu: 25um;
Finished Copper: 35um;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Main Board;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Military;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 6L up to 60L;
Board Thickness: 1.4mm up to 8mm;
Min Hole Size: 0.2mm;
Min. Hole Wall Cu: 20um;
Finished Copper: 35um;
Min. Trace/Space: 5/4mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Military;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 10L up to 60L;
Board Thickness: 1.2mm up to 8mm;
Min Hole Size: 0.2mm;
Min. Hole Wall Cu: 25um;
Finished Copper: 51um;
Min. Trace/Space: 5.5/4mil;
Supplier Name

Shandong Senrong New Materials Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier