Ti Bq78350-R1a Battery Power Charge Management Chip Electronic Components Integrated Circuit IC. pictures & photos

Ti Bq78350-R1a Battery Power Charge Management Chip Electronic Components Integrated Circuit IC.

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Price

Purchase Qty. Reference FOB Price

500-1,999 Pieces US$1.00

2,000-4,999 Pieces US$0.95

5,000+ Pieces US$0.90

Sepcifications

shape Flat
Conductive Type Bipolar Integrated Circuit
Integration MSI
Technics Semiconductor IC
Transport Package 2, 000 Large T&R
Trademark TI
Rating Catalog
RoHS Yes
Reach Yes
Operating Temperature Range (°c) -40 to 125

Product Description

Quality information RatingCatalog RoHSYes REACHYes Lead finish / Ball materialNIPDAU MSL rating / Peak reflowLevel-2-260C-1 YEAR Packaging information Package | PinsTSSOP (DBT) | 30 Operating temperature range (°C)-40 to 85 Package qty | Carrier2,000 | LARGE T&R Features for the ...

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Shenzhen Senchtec Technology Co., Ltd.

Gold Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products Drone, Fpv, Fpv Drone, Traversal Drone, Quadcopter, Flight Controller(FC), Electronic Speed Controller(ESC), Motors, Power IC, IC Chip
Registered Capital 1000000 RMB
Plant Area 101~500 square meters
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Power IC Comparison

	Ti Bq78350-R1a Battery Power Charge Management Chip Electronic Components Integrated Circuit IC. Contact Now	Quick View Mpu Arm Cortex-A8 Am3356bzczd60 Chip Contact Now	Quick View Fpga Spartan-3A Xc3s400A-4ftg256c Chip Contact Now	Quick View Cqfp Black Ceramic Fused Seal Housing 20 Wire Sop Packaging Contact Now	Quick View Sop Encapsulated Chip Black Ceramic 16 Wire Housing Contact Now

Transaction Info
	Ti Bq78350-R1a Battery Power Charge Management Chip Electronic Components Integrated Circuit IC. Contact Now	Quick View Mpu Arm Cortex-A8 Am3356bzczd60 Chip Contact Now	Quick View Fpga Spartan-3A Xc3s400A-4ftg256c Chip Contact Now	Quick View Cqfp Black Ceramic Fused Seal Housing 20 Wire Sop Packaging Contact Now	Quick View Sop Encapsulated Chip Black Ceramic 16 Wire Housing Contact Now
Price	US $ 0.90-1.00/ Piece	US $ 1.00-2.00/ Piece	US $ 1/ Piece	US $ 2.79/ Piece	US $ 1.47/ Piece
Min Order	500 Pieces	10 Pieces	10 Pieces	500 Pieces	500 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union	T/T, Western Union	T/T, Western Union	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification	ISO 9001	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Domestic	Domestic	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	-	-	-	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-
Product Attributes
Specification	shape: Flat; Conductive Type: Bipolar Integrated Circuit; Integration: MSI; Technics: Semiconductor IC; Rating: Catalog; RoHS: Yes; Reach: Yes; Operating Temperature Range (°c): -40 to 125;	shape: Flat; Conductive Type: Bipolar Integrated Circuit; Integration: VLSI; Technics: Semiconductor IC; Manufacturer: Texas Instruments; Package: Pbga-324; Data Bus Width: 32 Bit; Operating Supply Voltage: 1.1 V; Minimum Operating Temperature: - 40 C; Maximum Operating Temperature: + 105 C; Data RAM Size: 64 Kb; Data ROM Size: 176 Kb; I/O Voltage: 1.8 V, 3.3 V; Memory Type: L1/L2/L2 Cache, RAM, ROM; Processor Series: Sitara; Watchdog Timers: Watchdog Timer; Memory Card Interface: MMC/SD/Sdio; Package Height: 0.96(Max); Lead Shape: Ball;	shape: Flat; Conductive Type: Bipolar Integrated Circuit; Integration: VLSI; Technics: Semiconductor IC; Manufacturer: Xilinx; Product Category: Fpga - Field Programmable Gate Array; Embedded Memory: 360 Kbit; Number of I/OS: 195 I/O; Supply Voltage - Min: 1.14 V; Supply Voltage - Max: 1.26 V; Adaptive Logic Modules - Alms: 3584 Alm; Number of Logic Elements: 8064 Le; Minimum Operating Temperature: 0 C; Maximum Operating Temperature: + 85 C; Mounting Style: SMD/SMT; Package / Case: Fbga-256; Subcategory: Programmable Logic Ics; Unit Weight: 1.184515 Oz; Mpq: 450;	shape: Flat; Conductive Type: Normal; Integration: Normal; Technics: Semiconductor IC; ODM: OEM; Heat Dissipation: Excellent;	shape: Flat; Conductive Type: 1; Integration: 1; Technics: Semiconductor IC;
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