Specification |
Application: Food, Promotion;
Feature: Moisture Proof, Recyclable;
Material: Laminated Material;
Shape: Square Bottom Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
Business Type: Manufacturer Factory;
Printing Method: Digital Printing or Gravure Printing;
Hardness: Soft;
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Application: Food, Promotion, Household, Pricise Equipment, PC Board, IC, CD Driver;
Feature: Moisture Proof, Shock Resistance, Antistatic, Light Isolation;
Material: Laminated Material;
Shape: Open Top, Ziplock, Three Dimensional, Gusset;
Making Process: Composite Packaging Bag;
Raw Materials: Pet/Al/Ny/PE BOPP/Al/PE;
Bag Variety: Open Top, Ziplock, Three Dimensional, Gusse;
Function: Anti Static, Moisture Barrier, Light Isolation;
Industrial Use: Electronic Components, Semiconductive Industry;
Color: Silver;
Surface Handling: Gravure Printing;
Bag Type: Open Top, Zip Lock, Three Dimensional, Gusset;
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Application: Food, Promotion, Household, Pricise Equipment, PC Board, IC, CD Driver;
Feature: Moisture Proof, Shock Resistance, Antistatic, Light Isolation;
Material: Laminated Material;
Shape: Open Top, Ziplock, Three Dimensional, Gusset;
Making Process: Composite Packaging Bag;
Raw Materials: Pet/Al/Ny/PE BOPP/Al/PE;
Bag Variety: Open Top, Ziplock, Three Dimensional, Gusse;
Function: Anti Static, Moisture Barrier, Light Isolation;
Industrial Use: Electronic Components, Semiconductive Industry;
Color: Silver;
Surface Handling: Gravure Printing;
Bag Type: Open Top, Zip Lock, Three Dimensional, Gusset;
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Application: Food, Promotion, Household, Pricise Equipment, PC Board, IC, CD Driver;
Feature: Moisture Proof, Shock Resistance, Antistatic, Light Isolation;
Material: Laminated Material;
Shape: Open Top, Ziplock, Three Dimensional, Gusset;
Making Process: Composite Packaging Bag;
Raw Materials: Pet/Al/Ny/PE BOPP/Al/PE;
Bag Variety: Open Top, Ziplock, Three Dimensional, Gusse;
Function: Anti Static, Moisture Barrier, Light Isolation;
Industrial Use: Electronic Components, Semiconductive Industry;
Color: Silver;
Surface Handling: Gravure Printing;
Bag Type: Open Top, Zip Lock, Three Dimensional, Gusset;
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Feature: Barrier Water Vapour /Oxygen/Odor;
Material: PA/PE PA/CPP EVOH;
Thickness: 60mic-450mic(2.4mil-18mil);
Usage: Food Packaging;
Processing Type: Blow Molding or Cast;
Transparency: High Transparency;
Hardness: Soft;
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