Air Conditioning Mainboard
US$900.00-1,140.00 / Set

What is Mrv Vrf Vrv Multi-Split PCB Mainboard Frequency Conversion Module Mcc-1669-03p

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-19 Sets US$1,140.00

20-49 Sets US$1,000.00

50+ Sets US$900.00

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 64G
  • Structure ATX
  • Memory DDR2
  • SATA Interface SATA2.0
  • CPU Socket LGA 1366
  • Printed Circuit Board Four Layers
  • Main Board Structure Integrated
  • Audio Effects HiFi
  • Transport Package Carton Box
  • Specification Customized
  • Trademark Enfriar
  • Origin Zhejiang
  • Product Name Air Conditioning Compressor Main Board
  • Model Mcc-1669-03p
  • Description Frequency Conversion Module
  • Type Mrv Vrf Vrv
  • MOQ 1PC

Product Description

Product Description We supply all types of mother board for GMV, VRF, air conditioner, freezer. please tell model No. and pictures you want, we will quote you Specification item value Item Condition New Package Yes Ports DVI, PCI-E 3.0, PCI-Express X1, PCI-Express X16, ...

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Air Conditioning Mainboard Comparison
Transaction Info
Price US $ 900.00-1,140.00/ Set US $ 175.00-178.00/ Piece US $ 97.00-103.00/ Piece US $ 109.00-116.00/ Piece US $ 134.00-136.00/ Piece
Min Order 5 Sets 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, Western Union, Paypal, Money Gram, Global pay T/T, Western Union, Money Gram L/C, T/T, Western Union, Money Gram L/C, T/T, Western Union, Money Gram T/T, Western Union, Paypal
Quality Control
Management System Certification - ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million
Business Model - OEM, ODM, Own Brand() OEM, ODM, Own Brand() OEM, ODM, Own Brand() OEM, ODM, Own Brand()
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: ATX;
Memory: DDR2;
SATA Interface: SATA2.0;
CPU Socket: LGA 1366;
Printed Circuit Board: Four Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Product Name: Air Conditioning Compressor Main Board;
Model: Mcc-1669-03p;
Description: Frequency Conversion Module;
Type: Mrv Vrf Vrv;
MOQ: 1PC;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Nano-Itx;
Memory: DDR3;
SATA Interface: SATA3.0;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Warranty: 1 Year;
Memory Channel: Single;
Chipset: Intel Chipset Haswell-U;
Test Condition: 100% Tested Perfect;
Frequency: Dual Cores 1.8GHz;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Memory: DDR3;
SATA Interface: SATA;
CPU Socket: LGA 1150;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Chipset Manufacture: Intel;
Item Condition: New;
Socket Type: Intel Fcbga1170;
Memory Type: 1* So-DDR3 1333/1600m Low Voltage(1.35V) Memory;
Products Status: New, Stock;
Form Factor: Nano Itx;
Graphics Card Type: Integrating Intel HD Graphic GPU;
Fsb / Ht: 2.41GHz~2.58GHz;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Memory: DDR3;
SATA Interface: SATA;
CPU Socket: LGA 1150;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Chipset Manufacture: Intel;
Item Condition: New;
Socket Type: Intel Fcbga1170;
Memory Type: 1* So-DDR3 1333/1600m Low Voltage(1.35V) Memory;
Products Status: New, Stock;
Form Factor: Nano Itx;
Graphics Card Type: Integrating Intel HD Graphic GPU;
Fsb / Ht: 2.41GHz~2.58GHz;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: Mini-ITX;
Memory: 1*DDR3;
SATA Interface: SATA3.0;
CPU Socket: Socket AM2/AM2+;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Warranty: 1year;
Condition: 100% Test;
Supplier Name

Hangzhou Sino-Cold Sci-Tech Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier