Tape Wrapping Machine

US$1,300.00-3,500.00 / Piece

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What is Semi Automatic Tape Wrapping Machine Cable Tape Wrapped Tying Binding Machine

Name: Semi Automatic Tape Wrapping Machine Cable Tape Wrapped Tying Binding Machine
Uploaded: 2023-08-22T11:51:10+08:00
Description: Introduction: Automatic tape wrapping machine, it can wrap various wire and tube with tape, and is suitable for new energy wire harness processing industry equipment such as automobiles, aviation, hom

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$1,300.00-3,500.00 / Piece

Sepcifications

Condition New
Warranty 12 Months
Automatic Grade Semiautomatic
Specification 65*60*65cm
Origin China

Product Description

Introduction: Automatic tape wrapping machine, it can wrap various wire and tube with tape, and is suitable for new energy wire harness processing industry equipment such as automobiles, aviation, home appliances, machinery, electronics, and wire harnesses. Specification item value Place of ...

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Sinrad Technology Co., Ltd.

Gold Member Since 2020

Audited Supplier

Business Range Manufacturing & Processing Machinery
Main Products Soldering Machine, Wire Harness Processing Machine, Customize Automatic Machine, Wire Stripper, Terminal Crimping Machine
Type of Ownership Limited Company
Plant Area 600 square meters
Import & Export Mode Have Own Export License
OEM/ODM Availability Yes

Tape Wrapping Machine Comparison

	Semi Automatic Tape Wrapping Machine Cable Tape Wrapped Tying Binding Machine Contact Now	Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Contact Now	Quick View Efficiency Laser Trimming Equipment for Rapid Mass Production of Various Specifications of Chip Resistors Contact Now	Quick View High Efficient Automatic Chip Removal Moveable Ultrafast Laser Drilling Machine Contact Now	Quick View High Precision Auto-Positioning Si/Sicwafer Cutting Machine with Warpage/Taiko Wafer Transfer Contact Now

Transaction Info
	Semi Automatic Tape Wrapping Machine Cable Tape Wrapped Tying Binding Machine Contact Now	Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Contact Now	Quick View Efficiency Laser Trimming Equipment for Rapid Mass Production of Various Specifications of Chip Resistors Contact Now	Quick View High Efficient Automatic Chip Removal Moveable Ultrafast Laser Drilling Machine Contact Now	Quick View High Precision Auto-Positioning Si/Sicwafer Cutting Machine with Warpage/Taiko Wafer Transfer Contact Now
Price	US $ 1,300.00-3,500.00/ Piece	Negotiable	US $ 100,000.00-1,000,000.00/ Piece	US $ 100,000.00-1,000,000.00/ Piece	US $ 100,000.00-1,000,000.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T, Western Union, Paypal	T/T	T/T	T/T	T/T
Quality Control
Product Certification	-	RoHS, ISO, CE	-	-	-
Management System Certification	ISO 9001	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	Above US$100 Million	Above US$100 Million	Above US$100 Million	Above US$100 Million
Business Model	OEM, ODM	-	-	-	-
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: 6-12 months	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months
Product Attributes
Specification	Condition: New; Warranty: 12 Months; Automatic Grade: Semiautomatic;	After-sales Service: Provided; Function: High Temperature Resistance; Demoulding: Automatic; Condition: Used; Warranty: 12 Months; Automatic Grade: Automatic; Installation: Desktop; Driven Type: Electric; Mould Life: >1,000,000 Shots; Product Name: Wafer Back Grinding Equipment; Feature 1: High Precision; Feature 2: High Efficiency; OEM/ODM Service: Provided;	After-sales Service: Provided; Condition: New; Warranty: Provided; Automatic Grade: Manual; Installation: Vertical; Driven Type: Pneumatic; Product Name: Laser Trimming; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Warranty: 12 Months; Automatic Grade: Manual; Installation: Vertical; Driven Type: Pneumatic; Product Name: Ultrafast Laser High Speed Drilling Machine; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Warranty: 12 Months; Automatic Grade: Automatic; Installation: Vertical; Driven Type: Electric; Product Name: Wafer Laser Scribing / Cutting; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; OEM/ODM Service: Provided;
Supplier Name	Sinrad Technology Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.
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