Specification |
Application: Pricise Equipment, PC Board, IC, CD Driver;
Feature: Moisture Proof, Shock Resistance, Antistatic, Light Isolation;
Material: Laminated Material;
Shape: Open Top, Ziplock, Three Dimensional, Gusset;
Making Process: Composite Packaging Bag;
Raw Materials: Pet/Al/Ny/PE BOPP/Al/PE;
Bag Variety: Open Top, Ziplock, Three Dimensional, Gusset;
Function: Anti Static, Moisture Barrier, Light Isolation;
Industrial Use: Electronic Components, Semiconductive Industry;
Color: Silver;
Surface Handling: Gravure Printing;
Bag Type: Open Top, Zip Lock, Three Dimensional, Gusset;
|
Application: Food, Promotion, Household, Chemical;
Feature: Durable;
Material: PE;
Shape: Plastic Bags;
Making Process: Plastic Packaging Bags;
Raw Materials: Low Pressure Polyethylene Plastic Bag;
Bag Variety: Block Bottom Bag;
|
Application: Food, Promotion, Household, Chemical;
Feature: Durable;
Material: PE;
Shape: Plastic Bags;
Making Process: Plastic Packaging Bags;
Raw Materials: Low Pressure Polyethylene Plastic Bag;
Bag Variety: Block Bottom Bag;
|
Application: Food, Promotion, Household, Chemical;
Feature: Durable;
Material: PE;
Shape: Plastic Bags;
Making Process: Plastic Packaging Bags;
Raw Materials: Low Pressure Polyethylene Plastic Bag;
Bag Variety: Block Bottom Bag;
|
Application: Food, Promotion, Household, Chemical;
Feature: Durable;
Material: PE;
Shape: Plastic Bags;
Making Process: Plastic Packaging Bags;
Raw Materials: Low Pressure Polyethylene Plastic Bag;
Bag Variety: Block Bottom Bag;
|