Specification |
Application: PC Board, IC, CD Driver, HD Pack;
Feature: Moisture Proof, Antistatic;
Material: Laminated Material;
Shape: Open Top, Zip Lock, Gusset Bag;
Making Process: Composite Packaging Bag;
Raw Materials: APET/PE APET/CPP;
Bag Variety: Open Top Bag, Zip Lock Bag;
Function: Anti Static;
Industrial Use: Electronic Components, Semiconductive Industry;
Color: Semi-Transparent;
Surface Handling: Gravure Printing;
Bag Type: Open Top, Zip Lock;
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Application: Household;
Feature: Moisture Proof, Bio-Degradable, Disposable, Shock Resistance;
Material: PVC;
Shape: Seal Bag;
Making Process: Plastic Packaging Bags;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Clothing Bag;
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Application: Express;
Feature: Bio-Degradable;
Material: Cornstarch/PLA/Pbat;
Shape: Special Bag;
Making Process: Composite Packaging Bag;
Raw Materials: Cornstarch/PLA/Pbat;
Bag Variety: Your Bag;
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Application: Household, Express;
Feature: Bio-Degradable;
Material: Pbat+PLA;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: Pbat PLA;
Bag Variety: Back Seal Bags;
Delivery: 15-20 Days;
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Application: Promotion, Household, Chemical, Apparel;
Feature: Recyclable, Bio-Degradable, Shock Resistance;
Material: Paper;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Back Seal Bags;
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