PCB Assembly
US$1.00-5.00 / pieces
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What is Smart Electronics PCB Assembly PCBA Manufacturing Experience PCBA Circuit Board Factory

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-99 pieces US$5.00

100-999 pieces US$3.00

1,000+ pieces US$1.00

Sepcifications

  • Metal Coating Gold
  • Mode of Production SMT
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, ISO, CE
  • Customized Customized
  • Condition New
  • Transport Package Carton
  • Specification Customized
  • Trademark Smart
  • Origin Guangdong, China
  • Layer 1-24 Layers
  • Material Fr-4, High Tg, Isola, Aluminum, Rogers, etc
  • Min. Hole Size 0.15mm
  • Copper Thickness 0.5oz 1.0oz 2oz 3oz
  • Min Solder Resist Bridge 0.1mm
  • Min.Line Spacing 0.075mm
  • Min. Line Width 0.075mm
  • Mounting Component Pitch 0.15mm
  • Board Thickness 0.2mm-4mm
  • Solder Mask Green, Red, White, Yellow, Blue, Black, Orange etc
  • Surface Finishing HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc

Product Description

Products Description Product Name Custom Electronic Printed Circuit Board PCB Assembly Services OEM Other Multilayer PCB PCBA Manufacture Our Service Electronic Engineering; PCB Manufacturing; Turnkey PCBA; PCB Clone; SMT; Component Sourcing; PCB Assembly; Plugin Assembly; Packing Ect. Main ...

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PCB Assembly Comparison
Transaction Info
Price US $ 1.00-5.00/ pieces Negotiable Negotiable US $ 1.00-100.00/ Piece Negotiable
Min Order 5 pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal, Wechat/Alipay T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification RoHS, ISO, CE RoHS, CCC RoHS, CCC RoHS, CCC, ISO RoHS, CCC
Management System Certification ISO 9001 ISO 9001 ISO 9001 ISO 9001, IATF16949, QC 080000 ISO 9001
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$2.5 Million - US$5 Million - - US$10 Million - US$50 Million -
Business Model - - - OEM, ODM -
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Layer: 1-24 Layers;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
Min. Hole Size: 0.15mm;
Copper Thickness: 0.5oz 1.0oz 2oz 3oz;
Min Solder Resist Bridge: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Mounting Component Pitch: 0.15mm;
Board Thickness: 0.2mm-4mm;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Surface Finishing: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Form Factor: 55mm * 40mm;
Processor: Broadcom Bcm2711;
Input Power: DC 5V;
Operating Temperature: 0 ~ 80 ºC;
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Form Factor: 55mm * 40mm;
Processor: Broadcom Bcm2711;
Input Power: DC 5V;
Operating Temperature: 0 ~ 80 ºC;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2711;
Memory: 1g;
Connectivity: 2.4 GHz and 5.0 GHz IEEE 802.11b/G/N/AC Wireless;
Environment: Operating Temperature 0–50ºC;
Supplier Name

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

CENTURY SOLUTIONS LIMITED

Gold Member Audited Supplier

CENTURY SOLUTIONS LIMITED

Gold Member Audited Supplier

Shenzhen Zhendatech Co., Ltd.

Gold Member Audited Supplier

CENTURY SOLUTIONS LIMITED

Gold Member Audited Supplier