Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Raspberry Pi 4;
Model Number: Raspberry Pi 4 Model B;
RAM: 1GB, 2GB or 4GB;
USB Port: 2 USB 3.0 Ports; 2 USB 2.0 Ports;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Number of Layers: Custom;
Copper Thickness: 1 Oz;
Product Name: PCB Assembly;
Surface Finishing: HASL;
Transport: EMS,DHL,UPS,FedEx,TNT;
Certificate: RoHS/ISO9001/Ts16949/ISO14001/ISO13485;
Board Thickness: Custom, 1.6mm;
Testing Service: Ict,Fct,X-ray,Aoi;
Packaging Details: ESD Package with Cartons.;
Test: 100% Aoi / X-ray / Visual Test;
Min. Line Width: 0.075(3mil);
Supplier Type: OEM;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Lead Time: 1 Day;
Payment Term: Tt;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr;
Customized: Customized;
Condition: New;
MOQ: 1 Piece;
Handing Standards: Ipc-a-600h, Ipc-a-610f, J-Std-001f;
Technical Support: Free Dfm/a Check, Bom Analysis;
Assembly Abilities: SMT 5 Milli Points Per Day, DIP 10 Thousands Piec;
Assembly Details: 5 SMT + 2 DIP (Dust and Anti-Static Lines);
5 SMT + 2 DIP (Dust and Anti-Static Lin: PCB Design + PCB Fab + Components Sourcing + PCB;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming, W;
|