| Specification |
Metal Coating: Copper;
Mode of Production: SMT+DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-20 Layers;
Base Material: Kb;
Customized: Customized;
Condition: New;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 1-8 Oz;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-20 Layers;
Base Material: Kb;
Customized: Customized;
Condition: New;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 1.6mm;
Copper Thickness: 1-8 Oz;
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Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Certificate: ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Board Thickness: 0.2mm-8mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
Service: PCB/Componentssourcing/Assembly/Test/Package;
PCBA QA: X-ray, Aoi Test, in-Circuit Test (Ict);
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Profiling Punching: Routing, V-Cut, Beveling;
Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Tes;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Copper Thickness: 0.5-8oz;
Eng Thickness: 1-3u;
Board Thickness: 0.2-6mm;
Hard Gold Thickness: 5-50u;
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