Full Automatic 8 Heads Pick and Place Machine

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Price

Min. Order Reference FOB Price

1 Piece US$1.00-2.00 / Piece

Sepcifications

Condition New
Speed High Speed
Precision High Precision
Certification ISO, CE
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Standard Export Package
Trademark SUNY
Origin Hunan China
Feeder No. 70 (Front 38, Rear 32)
Nozzle Buffering Range 5.0mm
Power Supply 220V, 50Hz
Compressed Air 0.5-06MPa

Product Description

Item: Full Automatic 8 Heads Pick and Place Machine Model: SUNY-TPJ80 Product Advantages: 1. Total 10pcs of cameras: 1PC of Mark recognition camera, 8pcs of high speed recognition camera, 1PC of 8 million pixel high-precision recognition camera, synchronously recognize, effectively ensure ...

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Changsha Suny Electronic Technology Limited

Diamond Member Since 2020

Audited Supplier

Rating & Reviews: 5.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory & Trading Company
Main Products PCB Making Machine, Laboratory Instrument, Copper Plating Machine, Through Hole Machine, Etching Machine, Dry Film Laminator
Number of Employees 30
Year of Establishment 2012-02-09
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

SMT Full Line Comparison

	Full Automatic 8 Heads Pick and Place Machine Contact Now	Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment Contact Now	Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System Contact Now	Dual Head Dispensing High Speed LED Clip Wafer Die Bonder Contact Now	Semiconductor Bonding Equipment High Precision Wafer Placement Accuracy Die Bonder Machine Contact Now

Transaction Info
	Full Automatic 8 Heads Pick and Place Machine Contact Now	Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment Contact Now	Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System Contact Now	Dual Head Dispensing High Speed LED Clip Wafer Die Bonder Contact Now	Semiconductor Bonding Equipment High Precision Wafer Placement Accuracy Die Bonder Machine Contact Now
Price	US $ 1.00-2.00/ Piece	US $ 100,000.00-1,000,000.00/ Piece	Negotiable	Negotiable	US $ 100,000.00-1,000,000.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, Western Union, Money Gram	T/T	T/T	T/T	T/T
Quality Control
Product Certification	ISO, CE	ISO	RoHS, ISO, CE	RoHS, ISO, CE	ISO
Management System Certification	ISO 9001	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$2.5 Million - US$5 Million	Above US$100 Million	Above US$100 Million	Above US$100 Million	Above US$100 Million
Business Model	OEM, Own Brand(SUNY)	-	-	-	-
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: one month	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months
Product Attributes
Specification	Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Feeder No.: 70 (Front 38, Rear 32); Nozzle Buffering Range: 5.0mm; Power Supply: 220V, 50Hz; Compressed Air: 0.5-06MPa;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: High Precision; Feature 2: High Efficiency; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: High Precision; Feature 2: High Efficiency; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;
Supplier Name	Changsha Suny Electronic Technology Limited	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.
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