Gigabyte Trx40 B560 B650e B660I B760I Aorus Master AMD Motherboard Q470 Am4 AMD Ryzen DDR4 WiFi 10gbe LAN RGB W790 W480 Z590I W580 W480e

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

3 Pieces US$102.00-780.00 / Piece

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 64G
  • Structure Micro ATX
  • Memory DDR3
  • SATA Interface SATA3.0
  • CPU Socket LGA1700
  • Printed Circuit Board Four Layers
  • Main Board Structure Integrated
  • Audio Effects Not HiFi
  • Transport Package Color Box
  • Specification 17cm(L)*17cm(W)*23mm(H)
  • Trademark OEM/ODM
  • Origin Guangdong, China
  • Power Supply DC 12V or 19V Voltage
  • CPU Processor Alder Lake 12th Generation Core I5
  • Working Humidity 5%~95% Relative Humidity
  • Switch 1*F_Panel Pin;1*Jatx Pin

Product Description

Gigabyte Trx40 B560 B650e B660I B760I Aorus Master AMD Motherboard Q470 Am4 AMD Ryzen DDR4 WiFi 10gbe LAN RGB W790 W480 Z590I W580 W480e New Motherboard as TUF RO STRIX B550 B550M A F I E PLUS WIFI GMZR Support 5600X 5700G 5800X 5900X Chipset Intel® H610 Chipset Processor Support ...

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Motherboard B560 Comparison
Transaction Info
Price US $ 102.00-780.00/ Piece US $ 65.00-80.00/ Piece US $ 65.00-80.00/ Piece US $ 65.00-80.00/ Piece US $ 65.00-80.00/ Piece
Min Order 3 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram
Quality Control
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, ISO 14064, QC 080000 ISO 9001, ISO 9000, BS 25999-2 ISO 9001, ISO 9000, BS 25999-2 ISO 9001, ISO 9000, BS 25999-2 ISO 9001, ISO 9000, BS 25999-2
Trade Capacity
Export Markets Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Micro ATX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: LGA1700;
Printed Circuit Board: Four Layers;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
Power Supply: DC 12V or 19V Voltage;
CPU Processor: Alder Lake 12th Generation Core I5;
Working Humidity: 5%~95% Relative Humidity;
Switch: 1*F_Panel Pin;1*Jatx Pin;
Integrated Graphics: Integrated Graphics;
Main Chipset: Rockchip;
Maximum Memory Capacity: 8G;
Structure: Customs;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: None;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Rockchip;
Maximum Memory Capacity: 8G;
Structure: Customs;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: None;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Rockchip;
Maximum Memory Capacity: 8G;
Structure: Customs;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: None;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Rockchip;
Maximum Memory Capacity: 8G;
Structure: Customs;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: None;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Supplier Name

Shenzhen Huaxing Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Shining Star Electronic Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Shining Star Electronic Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Shining Star Electronic Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Shining Star Electronic Co., Ltd.

China Supplier - Diamond Member Audited Supplier