Wafer Thinner

US$20,000.00-60,000.00 / Piece

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Pangda Can Customize New CNC Silicon Wafer High Speed Thinning Machine pictures & photos

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What is Pangda Can Customize New CNC Silicon Wafer High Speed Thinning Machine

Name: Pangda Can Customize New CNC Silicon Wafer High Speed Thinning Machine
Uploaded: 2023-12-19T15:36:36+08:00
Description: Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electro

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$20,000.00-60,000.00 / Piece

Sepcifications

After-sales Service 12months
Warranty 12months
Type Surface Grinding Machine
Processing Object Flat Workpieces
Abrasives Grinding Wheel
Controlling Mode PLC
Automatic Grade Semiautomatic
Cylindrical Grinder Type Surface Grinding Machine
Precision High Precision
Certification ISO 9001
Condition New
Transport Package Wood Crate
Trademark PONDA
Origin China
Power Source Electricity
Disc(Wheel) Type Grinding Disc
Variable Speed with Variable Speed
Application Semiconductor Industry
Disc Diameter 220mm
Service Oversea Setup & After-Sale Avalaible
Class Thinner
Process Station 1
Abrasive Recyclable Water & Grinding Wheel
Wheel Rotate Speed 0-3000 Rpm
Workpiece Accuracy Control(Parallelism) 1um
Power of Grinding Wheel Motor 5.5kw

Product Description

Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ...

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Shenzhen Ponda Grinding Technology Co.,Ltd.

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Lapping Machine, Polishing Machine, Grinding Machine,Wafer Grinder, Single Plate Lapping and Polishing Machine, Double Plate Lapping and Polishing Machine, Lapping and CMP Systm, Abrasive Tools and Consumables
Registered Capital 1.48 Million USD
Plant Area 11500 square meters
Main Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Wafer Thinner Comparison

	Quick View Pangda Can Customize New CNC Silicon Wafer High Speed Thinning Machine Contact Now	Hydraulic Saddle Moving Surface Grinder Machine Sga3063ah Sga3063ahr Sga3063ahd Contact Now	Heavy Duty Surface Grinding Machine Fsg80160nc Fsg80220nc Fsg80300nc High Precision Grinder Contact Now	Universal Cylindrical Grinding Machine M1432b M1432 M1420 M1332 Contact Now	High Precision Universal Tool Grinder Machine 2m9120A Mq6025A Contact Now

Transaction Info
	Quick View Pangda Can Customize New CNC Silicon Wafer High Speed Thinning Machine Contact Now	Hydraulic Saddle Moving Surface Grinder Machine Sga3063ah Sga3063ahr Sga3063ahd Contact Now	Heavy Duty Surface Grinding Machine Fsg80160nc Fsg80220nc Fsg80300nc High Precision Grinder Contact Now	Universal Cylindrical Grinding Machine M1432b M1432 M1420 M1332 Contact Now	High Precision Universal Tool Grinder Machine 2m9120A Mq6025A Contact Now
Price	US $ 20,000.00-60,000.00/ Piece	US $ 1,000.00-15,000.00/ Piece	US $ 7,000.00-10,000.00/ Piece	US $ 5,000.00-10,000.00/ Piece	US $ 5,000.00-10,000.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal
Quality Control
Product Certification	ISO 9001	CE, RoHS, ISO 9001	CE, RoHS, ISO 9001	CE, RoHS, ISO 9001	CE, RoHS, ISO 9001
Management System Certification	-	ISO 9001, ISO 14000	ISO 9001, ISO 14000	ISO 9001, ISO 14000	ISO 9001, ISO 14000
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	OEM	OEM	OEM	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	-
Product Attributes
Specification	After-sales Service: 12months; Warranty: 12months; Type: Surface Grinding Machine; Processing Object: Flat Workpieces; Abrasives: Grinding Wheel; Controlling Mode: PLC; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New; Power Source: Electricity; Disc(Wheel) Type: Grinding Disc; Variable Speed: with Variable Speed; Application: Semiconductor Industry; Disc Diameter: 220mm; Service: Oversea Setup & After-Sale Avalaible; Class: Thinner; Process Station: 1; Abrasive: Recyclable Water & Grinding Wheel; Wheel Rotate Speed: 0-3000 Rpm; Workpiece Accuracy Control(Parallelism): 1um; Power of Grinding Wheel Motor: 5.5kw;	After-sales Service: Online Support; Warranty: One Year; Type: Surface Grinding Machine; Processing Object: Metel; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Manual; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: Precision; Condition: New; Table Size: 305X635mm; Wheel Size: 350X40X127mm; Longitudinal Travel: 765mm; Cross Travel: 340mm; Auto Feed: 0.1-8mm;	After-sales Service: Online Support; Warranty: One Year; Type: Surface Grinding Machine; Processing Object: Metel; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Manual; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: Precision; Condition: New; Table Size: 810X1600mm; Usage: Grind Surface;	After-sales Service: Online Support; Warranty: One Year; Type: Surface Grinding Machine; Processing Object: Metel; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Manual; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: Precision; Condition: New; Center Height: 180mm; Dia Ground(O.D): 8-320; Max Length Ground(O.D): 1000; Center Taper: Mt4;	After-sales Service: Online Support; Warranty: One Year; Type: Surface Grinding Machine; Processing Object: Metel; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Manual; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: Precision; Condition: New; Max Working Piece Length: 500mm; Size of Surface Grinder: 300X125; Size for Cutter Head: 200X500mm; Max Weight of Working Piece: 10kg; Work Head Swiver: 90 Degree;
Supplier Name	Shenzhen Ponda Grinding Technology Co.,Ltd.	TENGZHOU HOYONG MACHINERY CO., LTD	TENGZHOU HOYONG MACHINERY CO., LTD	TENGZHOU HOYONG MACHINERY CO., LTD	TENGZHOU HOYONG MACHINERY CO., LTD
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