High Precise Grinding Machine

US$8,000.00-20,000.00 / Piece

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High Speed Flat Grinding Equipment for Small Sapphire Workpieces on Silicon Wafers pictures & photos

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What is High Speed Flat Grinding Equipment for Small Sapphire Workpieces on Silicon Wafers

Name: High Speed Flat Grinding Equipment for Small Sapphire Workpieces on Silicon Wafers
Uploaded: 2023-11-30T17:33:46+08:00
Description: Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electro

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$8,000.00-20,000.00 / Piece

Sepcifications

After-sales Service 12months
Warranty 12months
Type Surface Grinding Machine, Surface Grinding Machine
Processing Object Flat Workpieces
Abrasives Grinding Wheel
Controlling Mode PLC
Automatic Grade Semiautomatic
Cylindrical Grinder Type Surface Grinding Machine
Precision High Precision
Certification ISO 9001
Condition New
Transport Package Wood Crate
Trademark PONDA
Origin China
Power Source Electricity
Disc(Wheel) Type Grinding Disc
Variable Speed with Variable Speed
Application Grinding Industry
Service Oversea Setup & After-Sale Avalaible
Class Single Plate
Process Station 3
Pressure Source Pneumatic or Weight Block
Plate Material Metal & Non-Metal
Abrasive Slurry
Weight 1000kg

Product Description

Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ...

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Shenzhen Ponda Grinding Technology Co.,Ltd.

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Lapping Machine, Polishing Machine, Grinding Machine,Wafer Grinder, Single Plate Lapping and Polishing Machine, Double Plate Lapping and Polishing Machine, Lapping and CMP Systm, Abrasive Tools and Consumables
Registered Capital 1.48 Million USD
Plant Area 11500 square meters
Main Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

High Precise Grinding Machine Comparison

	Quick View High Speed Flat Grinding Equipment for Small Sapphire Workpieces on Silicon Wafers Contact Now	Quick View Lpm Grinding Machine 150L Laboratory Vertical Nano Sand Mill Contact Now	CNC Centerless Grinder Mk1040 Profile Grinding Max. Diameter 40mm Contact Now	PLC Centerless Grinding Machine Mk10200 with 400mm Wheel Width for Bearing Rings Efficient Grinding Contact Now	Quick View 150L Grinder Laboratory Vertical Rod Pin Nanometer Sand Mill Contact Now

Transaction Info
	Quick View High Speed Flat Grinding Equipment for Small Sapphire Workpieces on Silicon Wafers Contact Now	Quick View Lpm Grinding Machine 150L Laboratory Vertical Nano Sand Mill Contact Now	CNC Centerless Grinder Mk1040 Profile Grinding Max. Diameter 40mm Contact Now	PLC Centerless Grinding Machine Mk10200 with 400mm Wheel Width for Bearing Rings Efficient Grinding Contact Now	Quick View 150L Grinder Laboratory Vertical Rod Pin Nanometer Sand Mill Contact Now
Price	US $ 8,000.00-20,000.00/ Piece	US $ 195,000.00-234,000.00/ Set	US $ 1.00-35,000.00/ Piece	US $ 1.00-100,000.00/ Piece	US $ 195,000.00-234,000.00/ Set
Min Order	1 Pieces	1 Sets	1 Pieces	1 Pieces	1 Sets
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal	T/T	L/C, T/T	L/C, T/T	T/T
Quality Control
Product Certification	ISO 9001	-	CE, ISO 9001	CE, ISO 9001	-
Management System Certification	-	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic	Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	OEM, ODM	OEM, Own Brand	OEM, Own Brand	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	Off-season: 1-3 Month(s) Peak-season: 3-6 Month(s)	Off-season: 1-3 Month(s) Peak-season: 3-6 Month(s)	-
Product Attributes
Specification	After-sales Service: 12months; Warranty: 12months; Type: Surface Grinding Machine, Surface Grinding Machine; Processing Object: Flat Workpieces; Abrasives: Grinding Wheel; Controlling Mode: PLC; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New; Power Source: Electricity; Disc(Wheel) Type: Grinding Disc; Variable Speed: with Variable Speed; Application: Grinding Industry; Service: Oversea Setup & After-Sale Avalaible; Class: Single Plate; Process Station: 3; Pressure Source: Pneumatic or Weight Block; Plate Material: Metal & Non-Metal; Abrasive: Slurry; Weight: 1000kg;	After-sales Service: Good After-Sales Service; Warranty: 1 Year; Type: Multi-Use Grinding Machine; Processing Object: Lithium Iron Phosphate, Ink, Alumina, Oxide; Controlling Mode: Electric Control System; Automatic Grade: Automatic; Precision: High Precision; Condition: New; Fineness of Grinding: 50 - 1500 Nm; Solvent System: Water-Based/Oil-Based; Motor Power: 250kw; Weight: 7500 Kg; Grinding Volume: 150L; Cooling Water Consumption: 6 M3/H; Feed Flow: 13000L/H;	After-sales Service: Long Term; Warranty: 1year; Type: Centerless Grinding Machine; Processing Object: Cylindrical Parts; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Manual; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: Precision; Condition: New; Accuracy: 0.002mm; Grinding Wheel: 350125127mm; Max Diameter: 40mm; Control System: Manual;	After-sales Service: Long Term; Warranty: 1year; Type: Centerless Grinding Machine; Processing Object: Bearing Rings; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: End Cylindrical Grinder; Precision: High Precision; Condition: New; Accuracy: 0.002mm; Grinding Wheel: P600400305mm; Max Diameter: 200mm; Control System: Manual;	After-sales Service: Good After-Sales Service; Warranty: 1 Year; Type: Multi-Use Grinding Machine; Processing Object: Lithium Iron Phosphate, Ink, Alumina, Oxide; Controlling Mode: Electric Control System; Automatic Grade: Automatic; Precision: High Precision; Condition: New; Fineness of Grinding: 50 - 1500 Nm; Solvent System: Water-Based/Oil-Based; Motor Power: 250kw; Weight: 7500 Kg; Grinding Volume: 150L; Cooling Water Consumption: 6 M3/H; Feed Flow: 13000L/H;
Supplier Name	Shenzhen Ponda Grinding Technology Co.,Ltd.	Dongguan Infor Machinery Technology Co., Ltd.	Jiangsu Phisong CNC Machines Co., Ltd.	Jiangsu Phisong CNC Machines Co., Ltd.	Dongguan Infor Machinery Technology Co., Ltd.
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