Wafer Thinning

US$20,000.00-60,000.00 / Piece

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Shen Zhen New Precision Thinning Machine for Silicon Wafers, Various Ceramics, Gallium Arsenide and Other Crystal Materials pictures & photos

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What is Shen Zhen New Precision Thinning Machine for Silicon Wafers, Various Ceramics, Gallium Arsenide and Other Crystal Materials

Name: Shen Zhen New Precision Thinning Machine for Silicon Wafers, Various Ceramics, Gallium Arsenide and Other Crystal Materials
Uploaded: 2023-12-01T14:31:06+08:00
Description: Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electro

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$20,000.00-60,000.00 / Piece

Sepcifications

After-sales Service 12months
Warranty 12months
Type Surface Grinding Machine, Surface Grinding Machine
Processing Object Flat Workpieces
Abrasives Grinding Wheel
Controlling Mode PLC
Automatic Grade Semiautomatic
Cylindrical Grinder Type Surface Grinding Machine
Precision High Precision
Certification ISO 9001
Condition New
Transport Package Wood Crate
Trademark PONDA
Origin China
Power Source Electricity
Disc(Wheel) Type Grinding Disc
Variable Speed with Variable Speed
Object Sapphire Substrate, Silicon Wafer, Ceramic Wafer
Application Grinding Industry
Material Hard Brittle Materials of Nonmetals and Metals
Disc Diameter 320mm
Service Oversea Setup & After-Sale Avalaible
Class Thinner
Process Station 1
Abrasive Recyclable Water & Grinding Wheel
Wheel Rotate Speed 0-3000 Rpm
Workpiece Accuracy Control(Parallelism) 1um
Power of Grinding Wheel Motor 5.5kw

Product Description

Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ...

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Shenzhen Ponda Grinding Technology Co.,Ltd.

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Lapping Machine, Polishing Machine, Grinding Machine,Wafer Grinder, Single Plate Lapping and Polishing Machine, Double Plate Lapping and Polishing Machine, Lapping and CMP Systm, Abrasive Tools and Consumables
Registered Capital 1.48 Million USD
Plant Area 11500 square meters
Main Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Wafer Thinning Comparison

	Quick View Shen Zhen New Precision Thinning Machine for Silicon Wafers, Various Ceramics, Gallium Arsenide and Other Crystal Materials Contact Now	Quick View High Precision and High Accuracy Polishing Machine for Silicon Wafers Contact Now	Quick View High Precision Double Side Surface Grinding and Polishing Machine for Aluminum Oxide Alloy Contact Now	Quick View Semi-automatic Plastic Crusher Blade Sharpener / Knife Sharpening Machine Contact Now	Quick View CNC High Precision Bridge Type Taiwan Planer Grinder Surface Grinding Machine Contact Now

Transaction Info
	Quick View Shen Zhen New Precision Thinning Machine for Silicon Wafers, Various Ceramics, Gallium Arsenide and Other Crystal Materials Contact Now	Quick View High Precision and High Accuracy Polishing Machine for Silicon Wafers Contact Now	Quick View High Precision Double Side Surface Grinding and Polishing Machine for Aluminum Oxide Alloy Contact Now	Quick View Semi-automatic Plastic Crusher Blade Sharpener / Knife Sharpening Machine Contact Now	Quick View CNC High Precision Bridge Type Taiwan Planer Grinder Surface Grinding Machine Contact Now
Price	US $ 20,000.00-60,000.00/ Piece	US $ 80,899.00-105,999.00/ Piece	US $ 60,000.00-100,000.00/ Piece	US $ 1,700.00-1,800.00/ Set	US $ 10,000.00-100,000.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Sets	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal	L/C, T/T	L/C, T/T, D/P, Western Union	L/C, T/T	L/C, T/T, D/P, Western Union, Paypal, Money Gram, Mobile pay
Quality Control
Product Certification	ISO 9001	ISO 9001	ISO 9001	CE, ISO 9001	GS, CE, RoHS, ISO 9001, Ks (South Korea)
Management System Certification	-	ISO 9001	ISO 9001	ISO 9001, ISO 9000, HSE	-
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic	Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Domestic	Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	OEM, ODM	OEM, ODM	OEM, Own Brand	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	-
Product Attributes
Specification	After-sales Service: 12months; Warranty: 12months; Type: Surface Grinding Machine, Surface Grinding Machine; Processing Object: Flat Workpieces; Abrasives: Grinding Wheel; Controlling Mode: PLC; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New; Power Source: Electricity; Disc(Wheel) Type: Grinding Disc; Variable Speed: with Variable Speed; Object: Sapphire Substrate, Silicon Wafer, Ceramic Wafer; Application: Grinding Industry; Material: Hard Brittle Materials of Nonmetals and Metals; Disc Diameter: 320mm; Service: Oversea Setup & After-Sale Avalaible; Class: Thinner; Process Station: 1; Abrasive: Recyclable Water & Grinding Wheel; Wheel Rotate Speed: 0-3000 Rpm; Workpiece Accuracy Control(Parallelism): 1um; Power of Grinding Wheel Motor: 5.5kw;	After-sales Service: 1 Year; Warranty: 1 Year; Type: Honing Machine; Processing Object: Metal & Non-Metal; Abrasives: Grinding Disc; Controlling Mode: Normal; Automatic Grade: Semiautomatic; Precision: High Precision; Condition: New; After-Sales Service Provided: Engineers Available to Service Machinery Overseas; Application: Manufacturing; Advantages: High Efficiency and Accuracy; Flatness: 0.002mm; Roughness: 0.01micron;	Type: Surface Grinding Machine; Automatic Grade: Semiautomatic; Precision: High Precision; Condition: New; Max. Grinding Diameter: 202mm; Feature: High Efficiency and Accuracy; Usage: Surface Polishing and Lapping; After-Sales Service Provided: Engineers Available to Service Machinery Overseas;	After-sales Service: Online support; Warranty: 1 Year; Type: Blade Sharpening Machine; Processing Object: Blade of Crusher; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: Normal Precision; Condition: New; Name: Blade Sharpening Machine; Product name: Industrial; Keywords: Knife Sharpener Professional; Motor: 7.5KW; Function: Grinding Tools Knife Blades; Processing: Surface Grinder Surface Grinding Machine; Color: Blue; Machine Type: Semi Automatic; Moving speed: 2.5 m/min; Working range(mm): 0-700mm;	After-sales Service: Excellent After-Sales Service; Warranty: One Year; Type: Surface Grinding Machine; Processing Object: Metal; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: Flat Grinder; Precision: High Precision; Condition: New; Cutting Capacity: 21.1m;* Max Thickness: 500mm; Worktable Dimension: 21m;* Front and Back Moving Speed: 5-28m/Min; Left and Right Moving Speed: 5-3000mm/Min; up and Down Moving Speed: 5-3000mm/Min; Min Calibration: 0.005mm; Power of Grinding Head Motor: 18.5kw; Speed of Grinding Head: 1400rpm/Min; Grinding Wheel Size: 50075203mm; Motor of Worktable: 11kw; Left and Right Moving Motor: 2kw; up and Down Moving Motor: 2kw; Machine Weight: 21t;
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