Wafer Thinner

US$20,000.00-60,000.00 / Piece

View

Transverse Wafer Grinder Thinning Polishing pictures & photos

Recommend for you
What is Sapphire Thinning Machine, According to Different Process Requirements of Frequency Conversion Speed Regulation Drive Mode
What is High Speed Vertical Thinning Machine to Prevent Workpiece Deformation and Damage Effectively
What is High Precision Automatic Double-Sided Grinding and Polishing Machine with Cycle or Drip Type

What is Transverse Wafer Grinder Thinning Polishing

Name: Transverse Wafer Grinder Thinning Polishing
Uploaded: 2023-11-30T18:23:41+08:00
Description: Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electro

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$20,000.00-60,000.00 / Piece

Sepcifications

After-sales Service 12months
Warranty 12months
Type Surface Grinding Machine, Thinning Equipment
Processing Object Flat Workpieces
Abrasives Grinding Wheel
Controlling Mode PLC
Automatic Grade Semiautomatic
Cylindrical Grinder Type Surface Grinding Machine
Precision High Precision
Certification ISO 9001
Condition New
Transport Package Wood Crate
Trademark PONDA
Origin China
Power Source Electricity
Disc(Wheel) Type Grinding Disc
Variable Speed with Variable Speed
Application Grinding Industry
Working Style Thinning
Service Oversea Setup & After-Sale Avalaible
Class Thinner
Process Station 1
Abrasive Recyclable Water & Grinding Wheel
Wheel Rotate Speed 0-3000 Rpm
Workpiece Accuracy Control(Parallelism) 1um
Power of Grinding Wheel Motor 5.5kw

Product Description

Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ...

Learn More

Shenzhen Ponda Grinding Technology Co.,Ltd.

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Lapping Machine, Polishing Machine, Grinding Machine,Wafer Grinder, Single Plate Lapping and Polishing Machine, Double Plate Lapping and Polishing Machine, Lapping and CMP Systm, Abrasive Tools and Consumables
Registered Capital 1.48 Million USD
Plant Area 11500 square meters
Main Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Wafer Thinner Comparison

	Quick View Transverse Wafer Grinder Thinning Polishing Contact Now	Quick View CNC Vertical Grinding Machine Tool Mkl654 Contact Now	Quick View Monthly Deals CNC Internal and Cylindrical Vertical Grinding Machine Tool Contact Now	Quick View CNC Vertical Internal and End Face Grinding Machine Tool Mkl654 Contact Now	Quick View CNC Vertical Grinding Machine Tool Mkl654 Contact Now

Transaction Info
	Quick View Transverse Wafer Grinder Thinning Polishing Contact Now	Quick View CNC Vertical Grinding Machine Tool Mkl654 Contact Now	Quick View Monthly Deals CNC Internal and Cylindrical Vertical Grinding Machine Tool Contact Now	Quick View CNC Vertical Internal and End Face Grinding Machine Tool Mkl654 Contact Now	Quick View CNC Vertical Grinding Machine Tool Mkl654 Contact Now
Price	US $ 20,000.00-60,000.00/ Piece	US $ 140,000.00-143,000.00/ Piece	US $ 140,000.00-143,000.00/ Piece	US $ 140,000.00-143,000.00/ Piece	US $ 140,000.00-143,000.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union	L/C, T/T, Western Union	L/C, T/T, Western Union	L/C, T/T, Western Union
Quality Control
Product Certification	ISO 9001	CE, ISO 9001	CE, ISO 9001	CE, ISO 9001	CE, ISO 9001
Management System Certification	-	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic	Europe, Domestic	Europe, Domestic	Europe, Domestic	Europe, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	-	-	-	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	After-sales Service: 12months; Warranty: 12months; Type: Surface Grinding Machine, Thinning Equipment; Processing Object: Flat Workpieces; Abrasives: Grinding Wheel; Controlling Mode: PLC; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New; Power Source: Electricity; Disc(Wheel) Type: Grinding Disc; Variable Speed: with Variable Speed; Application: Grinding Industry; Working Style: Thinning; Service: Oversea Setup & After-Sale Avalaible; Class: Thinner; Process Station: 1; Abrasive: Recyclable Water & Grinding Wheel; Wheel Rotate Speed: 0-3000 Rpm; Workpiece Accuracy Control(Parallelism): 1um; Power of Grinding Wheel Motor: 5.5kw;	Type: Internal Grinding Machine; Processing Object: Gear; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: Precision; Condition: New; Reciprocating Positioning Accuracy: 0.003mm; Positioning Accuracy: 0.008mm; Inner Hole and Cylindrical Roundness: 0.003mm; Inner Hole and Cylindricity: 0.005mm; End Face Flatness: 0.005/400; Inner Hole and Cylindrical Concentricity: 0.005mm;	Type: Internal Grinding Machine; Processing Object: Gear; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: Precision; Condition: New; Reciprocating Positioning Accuracy: 0.003mm; Positioning Accuracy: 0.008mm; Inner Hole and Cylindrical Roundness: 0.003mm; Inner Hole and Cylindricity: 0.005mm; End Face Flatness: 0.005/400; Inner Hole and Cylindrical Concentricity: 0.005mm;	Type: Internal Grinding Machine; Processing Object: Gear; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: Precision; Condition: New; Reciprocating Positioning Accuracy: 0.003mm; Positioning Accuracy: 0.008mm; Inner Hole and Cylindrical Roundness: 0.003mm; Inner Hole and Cylindricity: 0.005mm; End Face Flatness: 0.005/400; Inner Hole and Cylindrical Concentricity: 0.005mm;	Type: Internal Grinding Machine; Processing Object: Gear; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: Precision; Condition: New; Reciprocating Positioning Accuracy: 0.003mm; Positioning Accuracy: 0.008mm; Inner Hole and Cylindrical Roundness: 0.003mm; Inner Hole and Cylindricity: 0.005mm; End Face Flatness: 0.005/400; Inner Hole and Cylindrical Concentricity: 0.005mm;
Supplier Name	Shenzhen Ponda Grinding Technology Co.,Ltd.	WUXI CHANGYI MACHINE TOOL CO., LTD.	WUXI CHANGYI MACHINE TOOL CO., LTD.	WUXI CHANGYI MACHINE TOOL CO., LTD.	WUXI CHANGYI MACHINE TOOL CO., LTD.
Select All

Contact Now

Hot Search