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What is Fully Automatic Chamfering Machine Wafer Chamfering Machine
Price
Min. Order Reference FOB Price
1 Piece US$280,000.00-320,000.00 / Piece
Sepcifications
- After-sales Service 12months
- Warranty 12months
- Type Surface Grinding Machine, Wafer Chamfering Machine
- Processing Object Flat Workpieces
- Abrasives Grinding Wheel
- Controlling Mode Pcl
- Automatic Grade Semiautomatic
- Cylindrical Grinder Type Surface Grinding Machine
- Precision High Precision
- Certification ISO 9001
- Condition New
- Transport Package Wood Crate
- Specification 2000× 1150× 1950mm
- Trademark PONDA
- Origin China
- Power Source Electricity
- Working Style High-Speed Universal
- Variable Speed with Variable Speed
- Object Wafer
- Application Electronic Technique
- Disc(Wheel) Type Chamfering Machine
- Material Metal and Non-Metal
- Disc Diameter 2/4/6-Inch 4/6/8-Inch
- Weight 1000kg
- Applicable Wafer Size 2/4/6-Inch 4/6/8-Inch
- Wheel Diameter Medium 205 mm
- Wheel R. Speed 500- 3000 Min-1
- Wheel Motor Power 1kw
- Max. Travserse Rate 10 mm/S
- in-Feed Resolution 0.5μm/S
- Feed Ing Motor Power 0.4 Kw
- No. of Worktable 2
- Worktable Rotat. Speed 0-400 Min-1
- Thick. Inspect. Accuracy 0.5μm
- CCD Position. Accuracy 2.5μm
- Chamfering Roundness ≤10μm
- Chamfering Angularity ±0.05°
- Diameter Control ≤15μm
Product Description
Product Description The FDC wafer edge grinder is mainly used for edge chamfering of wafers. During the manufacturing process of chips, there may be issues with unevenness and sharpness at the edges, which may affect subsequent processing and use. Using a wafer edge rounding machine can round the ...
