Surface Lap Machine

US$30,000.00-50,000.00 / Piece

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Suitable for Sapphire Silicon Wafer Can Be Accurately Controlled Double - Sided Grinding and Polishing Machine pictures & photos

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What is Suitable for Sapphire Silicon Wafer Can Be Accurately Controlled Double - Sided Grinding and Polishing Machine

Name: Suitable for Sapphire Silicon Wafer Can Be Accurately Controlled Double - Sided Grinding and Polishing Machine
Uploaded: 2023-11-30T17:27:53+08:00
Description: Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electro

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$30,000.00-50,000.00 / Piece

Sepcifications

After-sales Service 12months
Warranty 12months
Type Surface Grinding Machine, Surface Grinding Machine
Processing Object Flat Workpieces
Abrasives Grinding Wheel
Controlling Mode PLC
Automatic Grade Semiautomatic
Cylindrical Grinder Type Surface Grinding Machine
Precision High Precision
Certification ISO 9001
Condition New
Transport Package Wood Crate
Trademark PONDA
Origin China
Power Source Electricity
Material Metal
Variable Speed with Variable Speed
Object Silicon Wafer, Quartz Wafer, Optical Crystal, Glas
Application Grinding Industry
Disc Diameter 386mm
Service Oversea Setup & After-Sale Avalaible
Class Double Plate
Process Station 3-5
Pressure Source Pneumatic
Plate Material Metal and Non-Metal
Abrasive Lapping Slurry

Product Description

Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, wafer ...

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Shenzhen Ponda Grinding Technology Co.,Ltd.

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Lapping Machine, Polishing Machine, Grinding Machine,Wafer Grinder, Single Plate Lapping and Polishing Machine, Double Plate Lapping and Polishing Machine, Lapping and CMP Systm, Abrasive Tools and Consumables
Registered Capital 1.48 Million USD
Plant Area 11500 square meters
Main Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Surface Lap Machine Comparison

	Quick View Suitable for Sapphire Silicon Wafer Can Be Accurately Controlled Double - Sided Grinding and Polishing Machine Contact Now	Quick View Xieli Machinery High Quality Centerless Grinding Machine Automatic Cylindrical Polishing Machine for Hardware China Factory Contact Now	Quick View Xieli Machinery High Precision Centerless Grinder Machine CNC Centerless Grinding Cemented Carbide with a Diamond Wheel Contact Now	Quick View Xieli Machinery Centerless Grinding Machine for Grind Medical Pipe Outer Wall and Taper Contact Now	Quick View Xieli Machinery Small CNC Centerless Grinding Machine: Principles and How It Works Contact Now

Transaction Info
	Quick View Suitable for Sapphire Silicon Wafer Can Be Accurately Controlled Double - Sided Grinding and Polishing Machine Contact Now	Quick View Xieli Machinery High Quality Centerless Grinding Machine Automatic Cylindrical Polishing Machine for Hardware China Factory Contact Now	Quick View Xieli Machinery High Precision Centerless Grinder Machine CNC Centerless Grinding Cemented Carbide with a Diamond Wheel Contact Now	Quick View Xieli Machinery Centerless Grinding Machine for Grind Medical Pipe Outer Wall and Taper Contact Now	Quick View Xieli Machinery Small CNC Centerless Grinding Machine: Principles and How It Works Contact Now
Price	US $ 30,000.00-50,000.00/ Piece	US $ 6,500.00-7,000.00/ set	US $ 6,500.00-7,000.00/ set	US $ 6,500.00-7,000.00/ set	US $ 6,500.00-7,000.00/ set
Min Order	1 Pieces	1 set	1 set	1 set	1 set
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union	L/C, T/T, D/P, Western Union	L/C, T/T, D/P, Western Union	L/C, T/T, D/P, Western Union
Quality Control
Product Certification	ISO 9001	GS, CE, ISO 9001	GS, CE, ISO 9001	GS, CE, ISO 9001	GS, CE, ISO 9001
Management System Certification	-	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic	South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	After-sales Service: 12months; Warranty: 12months; Type: Surface Grinding Machine, Surface Grinding Machine; Processing Object: Flat Workpieces; Abrasives: Grinding Wheel; Controlling Mode: PLC; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New; Power Source: Electricity; Material: Metal; Variable Speed: with Variable Speed; Object: Silicon Wafer, Quartz Wafer, Optical Crystal, Glas; Application: Grinding Industry; Disc Diameter: 386mm; Service: Oversea Setup & After-Sale Avalaible; Class: Double Plate; Process Station: 3-5; Pressure Source: Pneumatic; Plate Material: Metal and Non-Metal; Abrasive: Lapping Slurry;	After-sales Service: Support Online Video; Warranty: 1 Year; Type: Centerless Grinding Machine; Processing Object: Curve; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Manual; Cylindrical Grinder Type: Plunge Cylindrical Grinder; Precision: High Precision; Condition: New; Diameter: 0.6-60mm; Grinding Wheel Specification: P350125127; Guide Wheel Specification: P25012575; Grinding Wheel Rotating Speed: 2000r/Min; Guide Wheel Rotating Speed: Stepless5-240r/Min; Machine Dimension: 13009601300mm; Machine Tool Weight Approx: 1000kg;	After-sales Service: Support Online Video; Warranty: 1 Year; Type: Centerless Grinding Machine; Processing Object: Curve; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Manual; Cylindrical Grinder Type: Plunge Cylindrical Grinder; Precision: High Precision; Condition: New; Diameter: 0.6-60mm; Grinding Wheel Specification: P350125127; Guide Wheel Specification: P25012575; Grinding Wheel Rotating Speed: 2000r/Min; Guide Wheel Rotating Speed: Stepless5-240r/Min; Machine Dimension: 13009601300mm; Machine Tool Weight Approx: 1000kg;	After-sales Service: Support Online Video; Warranty: 1 Year; Type: Centerless Grinding Machine; Processing Object: Curve; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Manual; Cylindrical Grinder Type: Plunge Cylindrical Grinder; Precision: High Precision; Condition: New; Diameter: 0.6-60mm; Grinding Wheel Specification: P350125127; Guide Wheel Specification: P25012575; Grinding Wheel Rotating Speed: 2000r/Min; Guide Wheel Rotating Speed: Stepless5-240r/Min; Machine Dimension: 13009601300mm; Machine Tool Weight Approx: 1000kg;	After-sales Service: Support Online Video; Warranty: 1 Year; Type: Centerless Grinding Machine; Processing Object: Curve; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Manual; Cylindrical Grinder Type: Plunge Cylindrical Grinder; Precision: High Precision; Condition: New; Diameter: 0.6-60mm; Grinding Wheel Specification: P350125127; Guide Wheel Specification: P25012575; Grinding Wheel Rotating Speed: 2000r/Min; Guide Wheel Rotating Speed: Stepless5-240r/Min; Machine Dimension: 13009601300mm; Machine Tool Weight Approx: 1000kg;
Supplier Name	Shenzhen Ponda Grinding Technology Co.,Ltd.	Xingtai Xieli Machinery Manufacturing Co., Ltd.	Xingtai Xieli Machinery Manufacturing Co., Ltd.	Xingtai Xieli Machinery Manufacturing Co., Ltd.	Xingtai Xieli Machinery Manufacturing Co., Ltd.
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