Pangda Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines pictures & photos

Pangda Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines

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Price

Min. Order Reference FOB Price

1 Piece US$8,000.00-20,000.00 / Piece

Sepcifications

After-sales Service 12months
Warranty 12months
Type Surface Grinding Machine, Thinning Equipment
Processing Object Flat Workpieces
Abrasives Grinding Wheel
Controlling Mode Pcl
Automatic Grade Semiautomatic
Cylindrical Grinder Type Surface Grinding Machine
Precision High Precision
Certification ISO 9001
Condition New
Transport Package Wood Crate
Trademark PONDA
Origin China
Power Source Electricity
Disc(Wheel) Type Grinding Disc
Variable Speed with Variable Speed
Application Semiconductor Material
Material Metal and Non-Metal
Working Style Reduction
Disc Diameter Φ300
Service Oversea Setup & After-Sale Avalaible
Class Single Plate
Process Station 3
Pressure Source Pneumatic or Weight Block
Plate Material Metal & Non-Metal
Abrasive Slurry
Weight 1000kg

Product Description

Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ...

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Shenzhen Ponda Grinding Technology Co.,Ltd.

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Lapping Machine, Polishing Machine, Grinding Machine,Wafer Grinder, Single Plate Lapping and Polishing Machine, Double Plate Lapping and Polishing Machine, Lapping and CMP Systm, Abrasive Tools and Consumables
Registered Capital 1.48 Million USD
Plant Area 11500 square meters
Main Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Grinding Machine Comparison

	Pangda Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines Contact Now	New Gooda Wooden or Steel Box Metalwork Machinery CNC Machining Center with CE Contact Now	New Gooda Wooden or Steel Box Metalwork Machinery Machining Center with CE Contact Now	Vertical Machining, Precision Machining, High-End CNC Machining Center Contact Now	Automatic GS Approved Gooda Wooden or Steel Box Metalworking Tools CNC Machining Center Contact Now

Transaction Info
	Pangda Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines Contact Now	New Gooda Wooden or Steel Box Metalwork Machinery CNC Machining Center with CE Contact Now	New Gooda Wooden or Steel Box Metalwork Machinery Machining Center with CE Contact Now	Vertical Machining, Precision Machining, High-End CNC Machining Center Contact Now	Automatic GS Approved Gooda Wooden or Steel Box Metalworking Tools CNC Machining Center Contact Now
Price	US $ 8,000.00-20,000.00/ Piece	US $ 89,999.00-210,000.00/ set	US $ 89,999.00-210,000.00/ set	US $ 89,999.00-210,000.00/ set	US $ 89,999.00-210,000.00/ set
Min Order	1 Pieces	1 set	1 set	1 set	1 set
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	ISO 9001	GS, CE, RoHS, ISO 9001	GS, CE, RoHS, ISO 9001	GS, CE, RoHS, ISO 9001	GS, CE, RoHS, ISO 9001
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	-	-	-	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	-
Product Attributes
Specification	After-sales Service: 12months; Warranty: 12months; Type: Surface Grinding Machine, Thinning Equipment; Processing Object: Flat Workpieces; Abrasives: Grinding Wheel; Controlling Mode: Pcl; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New; Power Source: Electricity; Disc(Wheel) Type: Grinding Disc; Variable Speed: with Variable Speed; Application: Semiconductor Material; Material: Metal and Non-Metal; Working Style: Reduction; Disc Diameter: Φ300; Service: Oversea Setup & After-Sale Avalaible; Class: Single Plate; Process Station: 3; Pressure Source: Pneumatic or Weight Block; Plate Material: Metal & Non-Metal; Abrasive: Slurry; Weight: 1000kg;	After-sales Service: Whole Machine Life; Warranty: Free Replacement Parts Within The Warranty Period; Type: Surface Grinding Machine; Processing Object: Thread; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: End Cylindrical Grinder; Precision: High Precision; Condition: New; Max Height: 600mm; Column Width: 1800mm; Max Loading Weight: 6000kg; Controller System: Optional, Siemens/Fanuc/Mitsubishi; Max Length: 2500; Max Width: 1600; Mini Feed Size: 0.005;	After-sales Service: Whole Machine Life; Warranty: Free Replacement Parts Within The Warranty Period; Type: Surface Grinding Machine; Processing Object: Thread; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: End Cylindrical Grinder; Precision: High Precision; Condition: New; Max Height: 600mm; Column Width: 1800mm; Max Loading Weight: 6000kg; Controller System: Optional, Siemens/Fanuc/Mitsubishi; Max Length: 2500; Max Width: 1600; Mini Feed Size: 0.005;	After-sales Service: Whole Machine Life; Warranty: Free Replacement Parts Within The Warranty Period; Type: Surface Grinding Machine; Processing Object: Thread; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: End Cylindrical Grinder; Precision: High Precision; Condition: New; Max Height: 600mm; Column Width: 1800mm; Max Loading Weight: 6000kg; Controller System: Optional, Siemens/Fanuc/Mitsubishi; Max Length: 2500; Max Width: 1600; Mini Feed Size: 0.005;	After-sales Service: Whole Machine Life; Warranty: Free Replacement Parts Within The Warranty Period; Type: Surface Grinding Machine; Processing Object: Thread; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: End Cylindrical Grinder; Precision: High Precision; Condition: New; Max Height: 600mm; Column Width: 1800mm; Max Loading Weight: 6000kg; Controller System: Optional, Siemens/Fanuc/Mitsubishi; Max Length: 2500; Max Width: 1600; Mini Feed Size: 0.005;
Supplier Name	Shenzhen Ponda Grinding Technology Co.,Ltd.	Dongguan Gooda Machinery Manufacturing Co., Ltd.	Dongguan Gooda Machinery Manufacturing Co., Ltd.	Dongguan Gooda Machinery Manufacturing Co., Ltd.	Dongguan Gooda Machinery Manufacturing Co., Ltd.
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