Wafer Thinner

US$20,000.00-60,000.00 / Piece

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Model 320 Vertical Thinning Machine Equipped with Precision High Speed Rotating Spindle pictures & photos

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What is Model 320 Vertical Thinning Machine Equipped with Precision High Speed Rotating Spindle

Name: Model 320 Vertical Thinning Machine Equipped with Precision High Speed Rotating Spindle
Uploaded: 2023-12-01T16:07:51+08:00
Description: Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electro

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$20,000.00-60,000.00 / Piece

Sepcifications

After-sales Service 12months
Warranty 12months
Type Surface Grinding Machine, Surface Grinding Machine
Processing Object Flat Workpieces
Abrasives Grinding Wheel
Controlling Mode PLC
Automatic Grade Semiautomatic
Cylindrical Grinder Type Surface Grinding Machine
Precision High Precision
Certification ISO 9001
Condition New
Transport Package Wood Crate
Trademark PONDA
Origin China
Power Source Electricity
Disc(Wheel) Type Grinding Disc
Variable Speed with Variable Speed
Application Semiconductor Industry
Service Oversea Setup & After-Sale Avalaible
Class Thinner
Process Station 1
Abrasive Recyclable Water & Grinding Wheel
Wheel Rotate Speed 0-3000 Rpm
Workpiece Accuracy Control(Parallelism) 1um
Power of Grinding Wheel Motor 5.5kw

Product Description

Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ...

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Shenzhen Ponda Grinding Technology Co.,Ltd.

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Lapping Machine, Polishing Machine, Grinding Machine,Wafer Grinder, Single Plate Lapping and Polishing Machine, Double Plate Lapping and Polishing Machine, Lapping and CMP Systm, Abrasive Tools and Consumables
Registered Capital 1.48 Million USD
Plant Area 11500 square meters
Main Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Wafer Thinner Comparison

	Quick View Model 320 Vertical Thinning Machine Equipped with Precision High Speed Rotating Spindle Contact Now	Reciprocating Table Wheel Head Moving Surface Grinding Machine (MC7130W - MC7163W) Contact Now	Reciprocating Table Surface Grinder (MC7140G Series) Contact Now	Quick View Surface Grinding Machine (M7125A+) Contact Now	Quick View Simple Surface Grinder Small Universal Tool Grinder Manual Surface Grinding Machine Mj7115 Contact Now

Transaction Info
	Quick View Model 320 Vertical Thinning Machine Equipped with Precision High Speed Rotating Spindle Contact Now	Reciprocating Table Wheel Head Moving Surface Grinding Machine (MC7130W - MC7163W) Contact Now	Reciprocating Table Surface Grinder (MC7140G Series) Contact Now	Quick View Surface Grinding Machine (M7125A+) Contact Now	Quick View Simple Surface Grinder Small Universal Tool Grinder Manual Surface Grinding Machine Mj7115 Contact Now
Price	US $ 20,000.00-60,000.00/ Piece	US $ 10,000.00-20,000.00/ Piece	Negotiable	US $ 4,600.00-4,700.00/ Piece	US $ 1,200.00-1,350.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	FOB	-	-	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union, Paypal	L/C, T/T	L/C, T/T	L/C, T/T, Western Union, Paypal	L/C, T/T, Money Gram
Quality Control
Product Certification	ISO 9001	GS, CE	GS, CE, ISO 9001	GS, CE, ISO 9001	CE, ISO 9001
Management System Certification	-	ISO 9001, ISO 9000	ISO 9001, ISO 9000	-	-
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	-	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1-3 Month(s) Peak-season: 6-12 Month(s)	Off-season: 1-3 Month(s) Peak-season: 6-12 Month(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)
Product Attributes
Specification	After-sales Service: 12months; Warranty: 12months; Type: Surface Grinding Machine, Surface Grinding Machine; Processing Object: Flat Workpieces; Abrasives: Grinding Wheel; Controlling Mode: PLC; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New; Power Source: Electricity; Disc(Wheel) Type: Grinding Disc; Variable Speed: with Variable Speed; Application: Semiconductor Industry; Service: Oversea Setup & After-Sale Avalaible; Class: Thinner; Process Station: 1; Abrasive: Recyclable Water & Grinding Wheel; Wheel Rotate Speed: 0-3000 Rpm; Workpiece Accuracy Control(Parallelism): 1um; Power of Grinding Wheel Motor: 5.5kw;	After-sales Service: Be Included; Warranty: One Year; Type: Surface Grinding Machine; Processing Object: Metal; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Manual; Cylindrical Grinder Type: End Cylindrical Grinder; Precision: High Precision; Condition: New; Demands: Can Be Customized;	Type: Surface Grinding Machine; Processing Object: Curve; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: End Cylindrical Grinder; Precision: High Precision; Condition: New;	Type: Surface Grinding Machine; Processing Object: Surface; Abrasives: Abrasive Belt; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New;	Type: Surface Grinding Machine; Processing Object: Curve; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Manual; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: High Precision; Condition: New; Model: Mj7115; Longitudinal Stroke: 340mm; Lateral Stroke: 170mm; Gringding Height: 210mm; Motor Power: 550W;
Supplier Name	Shenzhen Ponda Grinding Technology Co.,Ltd.	NANJING UNITED MACHINERY CO., LTD.	NANJING UNITED MACHINERY CO., LTD.	Anhui Chizhou Household Machine Tool Co., Ltd.	Anhui Chizhou Household Machine Tool Co., Ltd.
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