Wafer Thinner

US$20,000.00-60,000.00 / Piece

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Ultra-Precision Wafer High Speed Grinding and Thinning Equipment pictures & photos

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What is Ultra-Precision Wafer High Speed Grinding and Thinning Equipment

Name: Ultra-Precision Wafer High Speed Grinding and Thinning Equipment
Uploaded: 2024-01-25T14:47:59+08:00
Description: Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electro

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$20,000.00-60,000.00 / Piece

Sepcifications

After-sales Service 12months
Warranty 12months
Type Surface Grinding Machine
Processing Object Flat Workpieces
Abrasives Grinding Wheel
Controlling Mode PLC
Automatic Grade Semiautomatic
Cylindrical Grinder Type Surface Grinding Machine
Precision High Precision
Certification ISO 9001
Condition New
Transport Package Wood Crate
Trademark PONDA
Origin China
Power Source Electricity
Disc(Wheel) Type Grinding Disc
Variable Speed with Variable Speed
Application Semiconductor Industry
Service Oversea Setup & After-Sale Avalaible
Class Thinner
Process Station 1
Abrasive Recyclable Water & Grinding Wheel
Wheel Rotate Speed 0-3000 Rpm
Workpiece Accuracy Control(Parallelism) 1um
Power of Grinding Wheel Motor 5.5kw

Product Description

Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ...

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Shenzhen Ponda Grinding Technology Co.,Ltd.

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Lapping Machine, Polishing Machine, Grinding Machine,Wafer Grinder, Single Plate Lapping and Polishing Machine, Double Plate Lapping and Polishing Machine, Lapping and CMP Systm, Abrasive Tools and Consumables
Registered Capital 1.48 Million USD
Plant Area 11500 square meters
Main Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Wafer Thinner Comparison

	Quick View Ultra-Precision Wafer High Speed Grinding and Thinning Equipment Contact Now	Quick View Universal Cutter Tool Grinder Grinding Machine for CNC Machine Contact Now	Quick View China Factory Economic Tool Post Grinder Tool Cutter Grinder for CNC Milling Cutting Machine Contact Now	Wide Wheel Conventional Centerless Grinding Machine with 600mm Wheel Width Contact Now	Vertical Honing Machine Contact Now

Transaction Info
	Quick View Ultra-Precision Wafer High Speed Grinding and Thinning Equipment Contact Now	Quick View Universal Cutter Tool Grinder Grinding Machine for CNC Machine Contact Now	Quick View China Factory Economic Tool Post Grinder Tool Cutter Grinder for CNC Milling Cutting Machine Contact Now	Wide Wheel Conventional Centerless Grinding Machine with 600mm Wheel Width Contact Now	Vertical Honing Machine Contact Now
Price	US $ 20,000.00-60,000.00/ Piece	US $ 850.00-1,200.00/ Piece	US $ 870.00-1,300.00/ Piece	US $ 1.00-100,000.00/ Piece	US $ 1,635.00-1,660.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal	L/C, T/T, D/P	L/C, T/T, D/P	L/C, T/T	T/T, Western Union, Paypal, X transfer
Quality Control
Product Certification	ISO 9001	ISO 9001	ISO 9001	CE, ISO 9001	-
Management System Certification	-	ISO 9001	ISO 9001	ISO 9001	-
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic	South America, Eastern Europe, Southeast Asia, Africa, Eastern Asia	South America, Eastern Europe, Southeast Asia, Africa, Eastern Asia	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, Own Brand	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1-3 Month(s) Peak-season: 3-6 Month(s)	-
Product Attributes
Specification	After-sales Service: 12months; Warranty: 12months; Type: Surface Grinding Machine; Processing Object: Flat Workpieces; Abrasives: Grinding Wheel; Controlling Mode: PLC; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New; Power Source: Electricity; Disc(Wheel) Type: Grinding Disc; Variable Speed: with Variable Speed; Application: Semiconductor Industry; Service: Oversea Setup & After-Sale Avalaible; Class: Thinner; Process Station: 1; Abrasive: Recyclable Water & Grinding Wheel; Wheel Rotate Speed: 0-3000 Rpm; Workpiece Accuracy Control(Parallelism): 1um; Power of Grinding Wheel Motor: 5.5kw;	After-sales Service: Lifetime After-Sales Service; Warranty: 12months Free Maintenance; Type: Tool Grinding Machine; Processing Object: Cutter; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Manual; Cylindrical Grinder Type: Tool Grinding Machine; Precision: Normal Precision; Condition: New; Machine Size: 75mm65mm65mm; X-Axis Travel: 270mm; Y-Axis Travel: 170mm; Worktable Size: 600mm130mm;* Machine Name: Tool Grinder; Nc Axis: No; Grinding Wheel Speed: 2800rpm; Grinding Wheel Head Travel: 140mm;	After-sales Service: Lifetime After-Sales Service; Warranty: 12months Free Maintenance; Type: Tool Grinding Machine; Processing Object: Cutter; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Manual; Cylindrical Grinder Type: Tool Grinding Machine; Precision: Normal Precision; Condition: New; Machine Size: 75mm65mm65mm; X-Axis Travel: 270mm; Y-Axis Travel: 170mm; Worktable Size: 600mm130mm;* Machine Name: Tool Grinder; Nc Axis: No; Grinding Wheel Speed: 2800rpm; Grinding Wheel Head Travel: 140mm;	After-sales Service: Long Term; Warranty: 1year; Type: Centerless Grinding Machine; Processing Object: Cylindrical Shafts; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Manual; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: Precision; Condition: New; Accuracy: 0.002mm; Grinding Wheel: P500600305mm; Max Diameter: 200mm; Control System: Manual;
Supplier Name	Shenzhen Ponda Grinding Technology Co.,Ltd.	Anhui Snalpo Machinery Equipment Co., Ltd.	Anhui Snalpo Machinery Equipment Co., Ltd.	Jiangsu Phisong CNC Machines Co., Ltd.	JIANGSU KEJI MACHINERY CO., LTD.
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