Wafer Thinner

US$20,000.00-60,000.00 / Piece

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Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine pictures & photos

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What is Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine

Name: Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine
Uploaded: 2023-11-30T17:58:57+08:00
Description: Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electro

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$20,000.00-60,000.00 / Piece

Sepcifications

After-sales Service 12months
Warranty 12months
Type Surface Grinding Machine, Thinning Machine
Processing Object Flat Workpieces
Abrasives Grinding Wheel
Controlling Mode PLC
Automatic Grade Semiautomatic
Cylindrical Grinder Type Surface Grinding Machine
Precision High Precision
Certification ISO 9001
Condition New
Transport Package Wood Crate
Trademark PONDA
Origin China
Power Source Electricity
Disc(Wheel) Type Grinding Disc
Variable Speed with Variable Speed
Application Semiconductor Industry
Material Hard Brittle Material
Working Style Thinning
Service Oversea Setup & After-Sale Avalaible
Class Thinner
Process Station 1
Abrasive Recyclable Water & Grinding Wheel
Wheel Rotate Speed 0-3000 Rpm
Workpiece Accuracy Control(Parallelism) 1um
Power of Grinding Wheel Motor 5.5kw

Product Description

Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ...

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Shenzhen Ponda Grinding Technology Co.,Ltd.

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Lapping Machine, Polishing Machine, Grinding Machine,Wafer Grinder, Single Plate Lapping and Polishing Machine, Double Plate Lapping and Polishing Machine, Lapping and CMP Systm, Abrasive Tools and Consumables
Registered Capital 1.48 Million USD
Plant Area 11500 square meters
Main Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Wafer Thinner Comparison

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Transaction Info
	Quick View Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine Contact Now	Quick View Lpm Series 150L High Capacity Grinder Vertical Nano Ceramic Sand Mill Contact Now	Quick View Lpm Series 400L Vertical Pigment and Paint Processing Equipment Nano Ceramic Sand Mill Contact Now	Manual Grinding Machine Surface Grinder Price Contact Now	Horizontal Sand Mill Nano Grinding Machine Contact Now
Price	US $ 20,000.00-60,000.00/ Piece	US $ 200,000.00-250,000.00/ Set	US $ 250,000.00-300,000.00/ Set	US $ 2,500.00-10,000.00/ Piece	US $ 2,500.00-10,000.00/ Piece
Min Order	1 Pieces	1 Sets	1 Sets	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal	T/T	T/T	L/C, T/T	L/C, T/T
Quality Control
Product Certification	ISO 9001	-	-	GS, CE, RoHS, ISO 9001	GS, CE, RoHS, ISO 9001
Management System Certification	-	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic	Domestic	Domestic	Southeast Asia, Eastern Asia	Southeast Asia, Eastern Asia
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	OEM, ODM	OEM, ODM	OEM	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	Off-season: 1-3 Month(s) Peak-season: 6-12 Month(s)	Off-season: 1-3 Month(s) Peak-season: 6-12 Month(s)
Product Attributes
Specification	After-sales Service: 12months; Warranty: 12months; Type: Surface Grinding Machine, Thinning Machine; Processing Object: Flat Workpieces; Abrasives: Grinding Wheel; Controlling Mode: PLC; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New; Power Source: Electricity; Disc(Wheel) Type: Grinding Disc; Variable Speed: with Variable Speed; Application: Semiconductor Industry; Material: Hard Brittle Material; Working Style: Thinning; Service: Oversea Setup & After-Sale Avalaible; Class: Thinner; Process Station: 1; Abrasive: Recyclable Water & Grinding Wheel; Wheel Rotate Speed: 0-3000 Rpm; Workpiece Accuracy Control(Parallelism): 1um; Power of Grinding Wheel Motor: 5.5kw;	After-sales Service: Good After-Sales Service; Warranty: 1 Year; Type: Machine; Processing Object: Silicon Carbon Anodes, Lithium Iron Phosphate, Ink; Controlling Mode: Electric Control System; Automatic Grade: Automatic; Precision: High Precision; Dynamic System: Energy-Saving Motor; Mode of Operation: Smart Large Screen; Fineness of Grinding: 50 - 1500 Nm; Solvent System: Water-Based/Oil-Based; Zirconia Bead: 0.1-2.0 mm; Motor Power: 160kw; Grinding Volume: 150L; Cooling Water Consumption: 6 M3/H; Dispersion Shaft Speed: 0-750 R/Min; Weight: 7500 Kg;	After-sales Service: Good After-Sales Service; Warranty: 1 Year; Type: Machine; Processing Object: Silicon Carbon Anodes, Lithium Iron Phosphate, Ink; Controlling Mode: Electric Control System; Automatic Grade: Automatic; Precision: High Precision; Dynamic System: Energy-Saving Motor; Mode of Operation: Smart Large Screen; Fineness of Grinding: 50 - 1500 Nm; Solvent System: Water-Based/Oil-Based; Zirconia Bead: 0.1-2.0 mm; Motor Power: 355kw; Grinding Volume: 400L; Cooling Water Consumption: 10 M3/H; Dispersion Shaft Speed: 0-750 R/Min; Weight: 9500 Kg;	Type: Surface Grinding Machine; Processing Object: Steel; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: High Precision; Condition: New; Control: Manual/Semi-Auto/Auto; Power: Electrical; Table Type: Normal-Table/Magic-Table; Moving Type: Bed-Moving; Grinding Wheel Diameter: 200mm; Grinding Wheel Speed: 3000 Rpm; Grinding Wheel Width: 25mm; Spindle Speed: 5000 Rpm; Workpiece Diameter: 100mm; Workpiece Length: 300mm; Grinding Depth: 0.1mm; Grinding Accuracy: ±0.002mm; Grinding Feed Rate: 50mm/Min; Grinding Wheel Dressing Method: Diamond Dresser; Coolant System: Flood Coolant;	Type: Surface Grinding Machine; Processing Object: Steel; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: High Precision; Condition: New; Control: Manual/Semi-Auto/Auto; Power: Electrical; Table Type: Normal-Table/Magic-Table; Moving Type: Bed-Moving; Grinding Wheel Diameter: 200mm; Grinding Wheel Speed: 3000 Rpm; Grinding Wheel Width: 25mm; Spindle Speed: 5000 Rpm; Workpiece Diameter: 100mm; Workpiece Length: 300mm; Grinding Depth: 0.1mm; Grinding Accuracy: ±0.002mm; Grinding Feed Rate: 50mm/Min; Grinding Wheel Dressing Method: Diamond Dresser; Coolant System: Flood Coolant;
Supplier Name	Shenzhen Ponda Grinding Technology Co.,Ltd.	Dongguan Infor Machinery Technology Co., Ltd.	Dongguan Infor Machinery Technology Co., Ltd.	YANGZHOU RZF IMP. AND EXP. CO., LTD.	YANGZHOU RZF IMP. AND EXP. CO., LTD.
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