Ceramic Capillary

US$4.00-5.00 / Piece

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Ceramic Capillary for Silver Wire Bonding pictures & photos

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What is Ceramic Capillary for Silver Wire Bonding

Name: Ceramic Capillary for Silver Wire Bonding
Uploaded: 2023-04-18T09:15:41+08:00
Description: Product Description Ceramic capillary is suitable for semiconductor packing of LED,IC chip and discrete devices Special semiconductor wire use/ball burning, tangent/ultrasonic heat transfer We

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Price

Purchase Qty. Reference FOB Price

100-499 branch US$5.00

500-999 branch US$4.50

1,000+ branch US$4.00

Sepcifications

Material Zirconia Ceramics
Application Wire Bonding
Transport Package Plastic Tub and Boxes
Specification zirconia ceramics
Origin China

Product Description

Product Description Ceramic capillary is suitable for semiconductor packing of LED,IC chip and discrete devices Special semiconductor wire use/ball burning, tangent/ultrasonic heat transfer We a wide range of semiconductor bonding tools from Die Attach to Wire Bonding. This includes Die ...

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Shenzhen Silver Technologies Ltd

Gold Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory
Main Products Alloy, Occ Wire, Bonding Wire, Copper Wire, PT/IR Alloy Wire, Platinum-Rhodium Wire, Platinum Coated with Nickel Wire, Platinum Tungsten Alloy Wire, Platinum Nickel Alloy Wire, PT Wire
Registered Capital 3000000 RMB
Plant Area 101~500 square meters
Management System Certification ISO 9001, ISO 14001, ISO 20000
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Ceramic Capillary Comparison

	Quick View Ceramic Capillary for Silver Wire Bonding Contact Now	Quick View Supply Semiconductor Single Crystal Silicon Wafer with N-Type 300mm for Solar Cell Contact Now	Quick View Customized Single Crystal Silicon Wafer25.425.40.5mm Si Substrate with Single Side Polished N/P Optional Wafer Contact Now	Quick View Factory Supply High-Purity Silicon 8 Inch 200mm Flat Type Silicon Wafers Contact Now	Ucc21520dwr/ Ti-Ucc21520 Stock of Our Company Contact Now

Transaction Info
	Quick View Ceramic Capillary for Silver Wire Bonding Contact Now	Quick View Supply Semiconductor Single Crystal Silicon Wafer with N-Type 300mm for Solar Cell Contact Now	Quick View Customized Single Crystal Silicon Wafer25.425.40.5mm Si Substrate with Single Side Polished N/P Optional Wafer Contact Now	Quick View Factory Supply High-Purity Silicon 8 Inch 200mm Flat Type Silicon Wafers Contact Now	Ucc21520dwr/ Ti-Ucc21520 Stock of Our Company Contact Now
Price	US $ 4.00-5.00/ Piece	US $ 1.00-100.00/ Piece	US $ 1.00-100.00/ Piece	US $ 1.00-100.00/ Piece	US $ 19.69/ Piece
Min Order	100 branch	25 Pieces	25 Pieces	25 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T
Quality Control
Management System Certification	ISO 9001, ISO 14001, ISO 20000	ISO 9001	ISO 9001	ISO 9001	ISO 9001, ISO 14001, OHSAS/ OHSMS 18001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	Own Brand	Own Brand	Own Brand	OEM, ODM, Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-
Product Attributes
Specification	Material: Zirconia Ceramics; Application: Wire Bonding;	Growth Method: CZ and Fz; Orientation: 111 or 100; Resistivity: 0.0005 to 150; Surface: Double Side Polished or Single Side Polished; Dopant: N Type and P Type; Particles: <30 at 0.3um; Bow: < 30 Um; Ttv: <15 Um; Manufacturing Technology: Optoelectronic Semiconductor; Material: Compound Semiconductor; Type: Intrinsic Semiconductor; Package: SMD; Signal Processing: Analog Digital Composite and Function; Application: LED; Model: 1324; Batch Number: Polished; Brand: Finewen;	Growth Method: CZ and Fz; Orientation: 111 or 100; Resistivity: 0.0005 to 150; Surface: Double Side Polished or Single Side Polished; Dopant: N Type and P Type; Particles: <30 at 0.3um; Bow: < 30 Um; Ttv: <15 Um; Manufacturing Technology: Optoelectronic Semiconductor; Material: Compound Semiconductor; Type: Intrinsic Semiconductor; Package: SMD; Signal Processing: Analog Digital Composite and Function; Application: LED; Model: 1324; Batch Number: Polished; Brand: Finewen;	Growth Method: CZ and Fz; Orientation: 111 or 100; Resistivity: 0.0005 to 150; Surface: Double Side Polished or Single Side Polished; Dopant: N Type and P Type; Particles: <30 at 0.3um; Bow: < 30 Um; Ttv: <15 Um; Manufacturing Technology: Optoelectronic Semiconductor; Material: Compound Semiconductor; Type: Intrinsic Semiconductor; Package: SMD; Signal Processing: Analog Digital Composite and Function; Application: LED; Model: 1324; Batch Number: Polished; Brand: Finewen;
Supplier Name	Shenzhen Silver Technologies Ltd	Jiaozuo Commercial Finewin Co., Ltd.	Jiaozuo Commercial Finewin Co., Ltd.	Jiaozuo Commercial Finewin Co., Ltd.	Shenzhen Gold Power Tech Co., Ltd.
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