Ceramic Capillary

US$4.00-5.00 / Piece

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Precision Ceramic Capillary for Wire Bonding Zirconia Capillary pictures & photos

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What is Precision Ceramic Capillary for Wire Bonding Zirconia Capillary

Name: Precision Ceramic Capillary for Wire Bonding Zirconia Capillary
Uploaded: 2023-04-17T16:39:09+08:00
Description: Product Description Ceramic capillary is suitable for semiconductor packing of LED,IC chip and discrete devices Special semiconductor wire use/ball burning, tangent/ultrasonic heat transfer We

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Price

Purchase Qty. Reference FOB Price

100-499 branch US$5.00

500-999 branch US$4.50

1,000+ branch US$4.00

Sepcifications

Material Zirconia Ceramics
Application Wire Bonding
Transport Package Plastic Tub and Boxes
Specification zirconia ceramics
Origin China

Product Description

Product Description Ceramic capillary is suitable for semiconductor packing of LED,IC chip and discrete devices Special semiconductor wire use/ball burning, tangent/ultrasonic heat transfer We a wide range of semiconductor bonding tools from Die Attach to Wire Bonding. This includes Die ...

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Shenzhen Silver Technologies Ltd

Gold Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory
Main Products Alloy, Occ Wire, Bonding Wire, Copper Wire, PT/IR Alloy Wire, Platinum-Rhodium Wire, Platinum Coated with Nickel Wire, Platinum Tungsten Alloy Wire, Platinum Nickel Alloy Wire, PT Wire
Registered Capital 3000000 RMB
Plant Area 101~500 square meters
Management System Certification ISO 9001, ISO 14001, ISO 20000
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Ceramic Capillary Comparison

	Quick View Precision Ceramic Capillary for Wire Bonding Zirconia Capillary Contact Now	(300mm) Double Side Polished Mono IC Wafer Contact Now	8 Inches (200mm) Double-Side Polished Mono-Crystalline IC Wafer Contact Now	(150mm) Double Side Polished IC Wafer Contact Now	4 5 6 8 Inches (125mm) Double Side Polished Mono IC Wafer Contact Now

Transaction Info
	Quick View Precision Ceramic Capillary for Wire Bonding Zirconia Capillary Contact Now	(300mm) Double Side Polished Mono IC Wafer Contact Now	8 Inches (200mm) Double-Side Polished Mono-Crystalline IC Wafer Contact Now	(150mm) Double Side Polished IC Wafer Contact Now	4 5 6 8 Inches (125mm) Double Side Polished Mono IC Wafer Contact Now
Price	US $ 4.00-5.00/ Piece	US $ 10.00-100.00/ Piece	US $ 10.00-100.00/ Piece	US $ 10.00-100.00/ Piece	US $ 10.00-100.00/ Piece
Min Order	100 branch	100 Piece	100 Piece	100 Piece	100 Piece
Trade Terms	-	-	-	-	-
Payment Terms	T/T	L/C, T/T	L/C, T/T	L/C, T/T	L/C, T/T
Quality Control
Management System Certification	ISO 9001, ISO 14001, ISO 20000	ISO 9001, OHSAS/ OHSMS 18001, QC 080000	ISO 9001, OHSAS/ OHSMS 18001, QC 080000	ISO 9001, OHSAS/ OHSMS 18001, QC 080000	ISO 9001, OHSAS/ OHSMS 18001, QC 080000
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Europe, Africa, East Asia(Japan/ South Korea)	Europe, Africa, East Asia(Japan/ South Korea)	Europe, Africa, East Asia(Japan/ South Korea)	Europe, Africa, East Asia(Japan/ South Korea)
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, Own Brand	OEM, Own Brand	OEM, Own Brand	OEM, Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)
Product Attributes
Specification	Material: Zirconia Ceramics; Application: Wire Bonding;	Manufacturing Technology: Integrated Circuits Device; Material: Element Semiconductor; Type: Both N and P Type; Package: PGA(Pin Grid Array Package); Application: IC; Size: 12 Inches;	Manufacturing Technology: Integrated Circuits Device; Material: Element Semiconductor; Type: Both N and P Type; Package: PGA(Pin Grid Array Package); Application: IC; Size: 8 Inches;	Manufacturing Technology: Integrated Circuits Device; Material: Element Semiconductor; Type: Both N and P Type; Package: PGA(Pin Grid Array Package); Application: IC; Size: 6 Inches;	Manufacturing Technology: Integrated Circuits Device; Material: Element Semiconductor; Type: Both N and P Type; Package: PGA(Pin Grid Array Package); Application: IC; Size: 5 Inches;
Supplier Name	Shenzhen Silver Technologies Ltd	Zhejiang Dongshuo New Energy Co., Ltd.	Zhejiang Dongshuo New Energy Co., Ltd.	Zhejiang Dongshuo New Energy Co., Ltd.	Zhejiang Dongshuo New Energy Co., Ltd.
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