PCB Board
US$1.00-100.00 / Square Meter
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What is Premium Multilayer PCB Circuit Board for Bluetooth Speaker Control PCB

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Square Meter US$1.00-100.00 / Square Meter

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Insulation Materials Organic Resin
  • Transport Package Strong and Secure
  • Specification 630*1100mm
  • Origin China

Product Description

PCB (printed circuit board), also known as printed circuit board, is one of the important components in the electronic industry. Almost every type of electronic device, from electronic watches and calculators to computers, communication electronics, and weapon systems, requires the use of printed ...

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PCB Board Comparison
Transaction Info
Price US $ 1.00-100.00/ Square Meter US $ 0.15-15.00/ Piece US $ 0.65-5.00/ Piece US $ 0.15-9.00/ Piece US $ 0.87-5.00/ Piece
Min Order 1 Square Meters 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms Online transactions T/T, D/P, Paypal, Money Gram T/T T/T, D/P, Paypal, Money Gram T/T, D/P, Paypal, Money Gram
Quality Control
Product Certification - RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification - ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets Domestic Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model - OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Supplier Name

Shenzhen Shitu Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier